CITC lab spaces ready to be equipped

November 1, 2019 – The CITC labs are almost ready to receive the first equipment. As building M on the Novio Tech Campus is a former Philips lab, its basic facilities are adequate to host CITC. Key equipment such as die-bonder, wire-bonder and ovens are made available through in-kind contribution from program participants. The equipment is currently being transferred to CITC. Other relevant equipment such as a fridge, freezers, dispense tools and 3D-AM tools are already on site.

Focus on scientific challenges

With the basic infra structure coming into place, it’s time to focus on the scientific challenges of micro-electronic packaging. There are quite a few:

• Devices miniaturise
• Power density increase material interfaces become more dominant
• Different physical domains are more intensively coupled.

On top of that, not only devices from the electrical domain are integrated in the package, CITC will also work on integrating chips from different domains such as optics.

There are a lot of challenges and opportunities ahead! At CITC we like to call this ‘Challunities’.