Downloads
This download section contains company documents and literature that is related to CITC’s program lines.
Company documents
- November 2020 – Semiconductor Packaging University Program brochure
- April 2020 – CITC brochure
- February 28 2020 – Press Release (in Dutch) ‘First Smart Industry Fieldlab award in Nijmegen: CITC’
- CITC Travel directions
Literature
Thermal High-Performance Packaging related
- September 2019, ATE-Experimental evaluation of a compact two-phase cooling system for high heat flux…
- June 2019, Design, fabrication and characterization of mems based micro heater for vaporizing liquid…
- June 2019, Lab-on-a-chip for individual cell response to light stimulation
- June 2019, MEMS Switches by Carbon Nanotubes with Silicon Carbide Coating
- June 2019, MS thesis Alisher Kurmanbay 2019
- June 2019, Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics
- January 2019, Multi-functional LED Module Integration and Miniaturization for Solid State Lighting Applications
- 2019, Effects of sintering pressure on the densification and mechanical properties of nanosilver…
- September 2018, Wafer Level Through-polymer Optical Vias
- August 2018, A new experimental approach to investigate the physics-of-failure of wirebond interconnects
- November 2017, Fabrication and characterisation of high aspect ratio MEMS electrochemical sensor
- October 2017, Investigation on Viscoplastic Properties of Au-Sn Die-attach Solder
- September 2017, Solid State Lighting Color Shift
- September 2017, The Lifetime Prediction of LED Drivers and Lamps
- July 2017, Carbon nanotube based solutions for on-chip thermal management
- June 2017, Nano-copper paste filled vertical interconnects
- January 2017, Monolithic 3D Wafer Level Integration
- December 2016, Flexible Interposer Based on Carbon Nanotubes and PDMS Composite
- December 2016, Wafer Level Packaging With Nano Metal Paste Interconnects For UV-C LEDs
- October 2016, A Miniaturized Temperature Controlled Capacitive MEMS Transducer for MOF based Gas…
- September 2016, Optical degradation mechanisms and accelerated reliability evaluation for LEDs
- September 2016, System in package for intelligent lighting and sensing applications
- January 2016, Multi-Scale Material and Technology for Heterogeneous Integration
- November 2015, Flexible Interposer Based on Carbon Nanotubes and PDMS Composite
- November 2015, Organic Materials Degradation in Solid State Lighting Applications
- October 2015, Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration
- September 2015, Thermally Driven Sound Source
- April 2015, Fast Qualification of Solder Reliability in Solid-state Lighting System
- November 2014, Low temperature fine pitch vertical wafer level interconnection using copper nanoparticles
- November 2014, Monolithic integration of light sensor readout system for multi-functional LED wafer-level…
- November 2014, Monolithic Integration of Rectifiers and Drivers for low power SSL applications on a Rigid to…
- September 2014, A Systematic Approach to Address the Reliability of Solid State Lighting Drivers
- September 2014, Thermal management of solid state lighting module
- December 2013, Foldable 3D Wafer Level SSL Package Using Flexible Interconnect
- October 2013, Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D Interconnect…
RF Chip Packaging related