Educating the next generation of high tech talent
April 1, 2021 – Novio Tech Campus – Together with HAN University of Applied Sciences, Chip Integration Technology Center (CITC) developed the Semiconductor Packaging University Program. An educational program tailored to the specific needs of all companies involved. The second edition starts first week of September 2021. This time, CITC aims to educate not only employees, but also bring in new talent, says general director of CITC, Barry Peet.
CITC is all about chips. The innovative tech center develops packaging and integration technology for chips to provide solutions to societal challenges. Barry: “We’re a non-profit innovation center, founded in 2019 in collaboration with TU Delft and TNO. CITC is where companies, research institutes and educational institutes work together to bridge the gap between academics and industry. We’re not doing research just to do research. We want our results to benefit the real world.”
Read the full article with quotes of Barry Peet and Gwen Visser, one of the first students: CITC: educating the next generation of high tech talent
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Find more info and register for the next edition of the semiconductor packaging program