European Microelectronics & Packaging Conference 2023
CITC will participate in the 24th European Microelectronics & Packaging Conference (EMPC). EMPC is held from September 12-14 at the Wellcome Genome Campus, Hinxton, UK.
Together with Henkel
During the conference, CITC’s Edsger Smits will give a presentation together with Ruud De Wit from our partner Henkel. Their presentation is called ‘Improving Semiconductor Reliability of Silver Sinter Die Attach Materials for Large Die on Lead Frame Applications’. It is part of the S5A session on Sintering on September 13, from 9:45 am – 10:45 am.
In the exhibition area, we will share booth 17 with Henkel and Caplinq.
During three conference days, visitors will hear about the latest developments in electronic packaging technologies. The conference covers a diverse range of topics including industry trends, integration, thermal management and sustainable electronics.
The event will introduce new materials and opportunities in the packaging of electronic devices and potential applications of systems. Attendees and exhibitors are able to network personally in the spacious surrounds of the Wellcome Genome Campus.
Read more about our partnership with Henkel