Holland Semiconductors Topic Special on Advanced Packaging
On July 1, CITC will participate in the Holland Semiconductors Topic Special on Advanced Packaging. During the online live broadcast, CITC’s general manager Barry Peet will discuss his views on Advanced Packaging.
The event will be hosted and moderated by Tom van der Dussen, project manager of Holland Semiconductors. The panel is completed by Eric Beyne, senior fellow, VP R&D, director 3D System Integrations Program at Imec and Oliver Maiwald, ceo of Sencio.