Packaging technology Event

Invitation: Virtual Forums

Power and RF Packaging Virtual Forums – presented by Yole Développement and CITC
– November 24th 2020, 2-5 PM (CET) for Power Packaging
– December 1st 2020, 2-5 PM (CET) for RF Packaging

Packaging technologies are expanding the boundaries of RF and power applications
Yole Développement, a renowned market research company, and CITC, innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems – and to ensure these applications’ continued evolution and activity development, packaging is the strategic answer.

With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product. Save the date in your agenda today and let’s meet online on November 24 and December 1, 2020!

The event website is live, click this link for more information. We are open for registration and sponsoring.
Additional questions? Contact Marco Koelink, Business Development Manager