Packaging technology Event

Power and RF Virtual Forums replays available

On November 24 and December 1, 2020 the Virtual Forums for Power and RF Packaging, presented by Yole Développement and CITC, took place. The forums included presentations of Amkor, AT&S, VTT, Osaka University and more. Both events were very succesful with interesting presentations and many questions from the audence.

Replays available

Did you miss the forums? No problem, you can still get access to the recorded presentations. Please read the information below or register directly to join the events:

Access to the Power Packaging Virtual Forum replay
Access to the RF Packaging Virtual Forum replay

Expanding the boundaries of RF and power applications

Yole Développement, a renowned market research company, and CITC organized the two collaborative online forums on power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems. To ensure these applications’ continued evolution and activity development, packaging is the strategic answer.

With increased functionalities, companies must refine their ability to integrate more and more components on the same die. At the same time, it is of key imporantance that the final product is exceptionally reliable.

Additional questions? Contact Marco Koelink, Business Development Manager