Packaging technology Event

Power and RF Virtual Forums replay available

On November 24th and December 1st 2020 the Virtual Forum for Power and RF Packaging, presented by Yole Développement and CITC, took place with presentations of Amkor, AT&S, VTT, Osaka University and more. Both events were very succesful with interesting presentations and many questions from the audence. Did you miss it? No problem, you can still get access to the recorded presentations. Read the information below or register directly to join the events:
Access to the Power Packaging Virtual Forum replay
Access to the RF Packaging Virtual Forum replay

Packaging technologies are expanding the boundaries of RF and power applications
Yole Développement, a renowned market research company, and CITC, innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems – and to ensure these applications’ continued evolution and activity development, packaging is the strategic answer.

With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product. Learn more Power and RF Packaging in the Virtual Forums. Click this link for more information and register for on demand participation, it is free of charge!

Additional questions? Contact Marco Koelink, Business Development Manager