Photonic Integration conference
On September 30, CITC and partner Jakajima will organize a conference on packaging and assembly of photonic integrated circuits (PICs).
Photonics is the key enabling technology needed to keep the globe communicating and connected in the 21st century. The integration of optical components and functions into large-scale photonic integrated circuits will result in miniaturization and decrease of cost price. That will in turn lead to more applications.
Packaging and assembly technologies are crucial to make devices available for high-volume and low-cost applications. This includes heterogeneous integration: the dense integration of compound semiconductor photonics and silicon microelectronics. It allows for significant reductions in system size, weight and power, while simultaneously yielding performance improvements and new functionality.
The topics of this year’s edition focus on packaging and assembly:
- Materials and processes for Photonics Assembly: challenges and solutions
- Equipment for Photonics Assembly: challenges and solutions
CITC lab tour
After the conference, there will be a guided CITC laboratory tour for the participants of the live conference. You can check out the CITC packaging assembly technologies such as high-precision dispensing, automated die-pickup and die-attach, wire-bonding and temperature profile curing.