Semiconductor Packaging University Program – Edition 2021-2022
Edition 2021-2022 of the Semiconductor Packaging University Program starts first week of September. The course, with a duration of about 5 months, enables both students and company employees to get training in all relevant aspects in the field of semiconductor packaging, both theoretical and practical. Edition 2020-2021 was very successful. Read more about it in this Microwave Journal article ‘Kick-off to Unique Semiconductor Packaging Education Program’.
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