Semiconductor Packaging University Program – Edition 2021-2022

Edition 2021-2022 of the Semiconductor Packaging University Program starts first week of September. The course, with a duration of about 5 months, enables both students and company employees to get training in all relevant aspects in the field of semiconductor packaging, both theoretical and practical. Edition 2020-2021 was very successful. Read more about it in this Microwave Journal article
‘Kick-off to Unique Semiconductor Packaging Education Program’.

Interested to join the next edition? Don’t be too late and register now!
Semiconductor Packaging University Program – Edition 2021-2022