Traineeship News

Internship and graduation assignments

January 4 2021  – A new year with new opportunities! There are possibilities for internship and graduation assignments at CITC. Have a look below or at: Internship – CITC

– Student project: Software interface for predictive reliability of Power Packages
Goal of this student project is to design a user friendly software interface allowing to seamlessly communicate to a CITC test platform placed in TMCL oven and external power control and measurement hardware. You are a highly motivated and enthusiastic student in computer science, mechanical engineering, material science or (applied) physics. You have good communication skills in English and you are independent, but also a team player. This internship has a duration of max. 9 months. Read more

– Internship/ graduation assignment: Antenna design and simulations for Antenna-in-Package applications
You are a highly motivated and enthusiastic student from electrical engineering or applied physics with an affinity for electromagnetic simulations. You have good communication skills in English and you are independent, but also a team player. You are interested in performing electromagnetic simulations of innovative RF and antenna systems and in learning about manufacturing technologies for electronics packaging. This internship/ graduation assignment has a duration of 3-9 months. Read more

– Open sollicitation for an internship at CITC
Are you a highly motivated and enthusiastic student in one of the following fields: Electric engineering, Mechanical engineering, Applied physics or Material science? Are you willing to work in the field of semiconductor packaging in a highly dynamic environment on the crossroad of academia and industry? Are you interested in developing novel semiconductor packaging concepts? If YES, then contact us at CITC for an internship assignment as we might be looking for YOU. Read more