Internship Software Interface for Predictive Reliability of Power Packages
The world we live in has many social challenges. Improving healthcare, renewable energy transition, make the world a safer place. Package and integration development for chips is the key to global innovation. At Chip Integration Technology Center (CITC) we have an internship position for a student project: software interface for predictive reliability of power packages.
Internship – Student Project: Software Interface for Predictive Reliability of Power Packages
CITC – ‘Chip Integration Technology Center’ – is the center that develops new chip integration (also called ‘Advanced Packaging’ or ‘Heterogeneous Integration’) technologies. The center is located in Nijmegen at the Novio Tech Campus and is a cooperation between Universities/ Research Institutes and companies. Industrial companies work together with TNO and TU Delft to develop new and innovative Chip Integration technologies.
Are you a highly motivated and enthusiastic student in applied physics, electrical or mechanical engineering? Are you will willing to work in the field of semiconductor packaging in a highly dynamic environment on the crossroad of academia and industry? Are you interested in developing novel semiconductor packaging concepts and strategies to predict and monitor package reliability? If YES, then contact us at CITC as we are looking for YOU.
You are a highly motivated and enthusiastic student in computer science, mechanical engineering, material science or (applied) physics. You have good communication skills in English and you are independent, but also a team player. Are you skilled in Labview and willing to design one of a kind software interface for a unique reliability system? Are you will willing to obtain an experience in the field of semiconductor packaging in a highly dynamic environment on the crossroad of academia and industry? Are you interested in developing novel semiconductor packaging concepts and strategies to predict and monitor package reliability? If YES, then send us your CV. This student project is an internship with a total duration of 9 months (with a minimum period of 6 months).
Location – CITC, Nijmegen
Position – Internship
Common way to evaluate reliability of packages is to run lengthy cycles in a thermocycling oven (TMCL). This process is rather digital, allowing to learn whether newly developed packages “pass” or “fail” after certain number of cycles. This significantly slows down development and evaluation of new technologies and packaging concepts. CITC is developing a unique in-situ characterization platform allowing to monitor reliability of packages while undergoing conventional reliability analysis in thermocycling oven (TMCL) – this provides essential live feedback in terms of current state of the package, ultimately allowing fast-track development of reliable and cost-effective packaging solution.
The multidisciplinary team at CITC is focused on development of novel thermo-mechanical design strategies and device packaging platforms composed of low stress and high reliability rugged interconnects. It is essential to be able to predict and monitor reliability of such packaging concepts. In particular, being able to distinguish and understand failure mechanisms and modes occurring in a newly developed package would greatly facilitate development and commercialization of new generation, reliable power packages.
Simplified schematics of in-situ characterization platform is shown in the figure below. Project objective is to design a user friendly software interface in Labview allowing to seamlessly communicate to a CITC test platform placed in TMCL oven and external power control and measurement hardware.
The goal is to design a user friendly software interface in Labview allowing to seamlessly communicate to a CITC test platform placed in TMCL oven and external power control and measurement hardware.
As a team member your tasks will be:
- Knowledge acquisition through literature survey and discussion with other team members
- Designing and troubleshooting software
- Performing experiments in world-class assembly and integration facilities
- Analysis of the experimental data and presentation thereof
- Documenting results in a technical report and taking part in technical meetings, internal seminars/colloquiums
- S!MPAC simserv (protocol with oven)
Gari Arutinov, firstname.lastname@example.org