Job opening Process Engineer Semiconductor interconnection technology

About CITC

We are Chip Integration Technology Center (CITC), a non-profit, open innovation center specializing in heterogeneous integration and advanced chip packaging. Our work revolves around innovation; in our labs, researchers and entrepreneurs work together on the next generation of semiconductors and photonics. CITC was founded in 2019 with strategic partners TNO and TU Delft and is supported by leading partners from the chip industry, universities, local and regional governments.

The job opening

Currently, we are looking for a process engineer to strengthen our team. You will be working at the intersection of materials science, process technology, microelectronics and packaging in a multidisciplinary research environment.

As a process engineer you will be:

• Developing interconnect and assembly processes for a next generation of high-power devices
• Participating with expertise and taking responsibility in ongoing collaborative projects with international customers
• Interacting with our industrial partners and customers on a day-to-day basis

Your background and skills

You have a BSc degree in mechanical engineering, electrical engineering or materials science. Preferably, you have 3 to 7 years of experience in the semiconductor industry in package development or assembly engineering. Your expertise includes hands-on knowledge of package reliability requirements, failure analysis techniques and quality systems. And your knowledge of assembly materials such as die attach, passivation and encapsulation, is excellent.

Skills and qualities that will help you succeed in this job include:

• Hands-on mentality: you are able to organize practical work in an efficient and cooperative way
• Knowledgeable at data handling, analysis and communication of results
• Good communication skills in English.