CITC presents chip package mock-up and lab video

October 19, 2020 – CITC has released a new video. It features a chip package mock-up and our lab. It shows how CITC addresses the challenges of building new generation packages providing a safe and rugged housing for semiconductor chips. We created a demonstrator chip package that is scaled about 20 times. It clearly demonstrates what we do. To tackle the exciting challenges we collaborate with knowledge institutes and industrial partners as collaboration is key to success.

Contact Marco Koelink, Business Development Manager, for more information