Chip package mock-up & lab video

October 19 2020 – It is a pleasure to share a new CITC video with you. This chip package mock-up & lab video shows how we, as Research and Development center, address the challenges of building new generation packages providing a safe and rugged housing for semiconductor chips. We created a demonstrator chip package that is scaled about 20 times. It will show you what we do. To tackle the exciting challenges we collaborate with knowledge institutes and industrial partners as collaboration is key to success!

Contact Marco Koelink, Business Development Manager, for more information