Application for internship at CITC

The world we live in has many societal challenges. Who wouldn’t like to improve healthcare? Or speed up the renewable energy transition? Or make the world a safer place? To achieve this, innovation is paramount.

Package and integration development for chips is the key to global innovation. If you would like to contribute to finding new chip packaging solutions, then apply for an internship at Chip Integration Technology Center (CITC).

About CITC

CITC is a research center that develops new chip integration technologies. These are also called ‘advanced packaging’ or ‘heterogeneous integration’ technologies. The center is located in Nijmegen at the Novio Tech Campus.

As an open innovation center, CITC works work together with TNO and TU Delft to develop new and innovative chip integration technologies. Providing access to education is one of CITC’s core values. Therefore, we regularly offer internship assignements. An internship can last 3-9 months, location is Nijmegen.

About you

Are you a motivated and enthusiastic student in one of the following fields:

  • Electrical engineering
  • Mechanical engineering
  • Applied physics
  • Material science

Are you willing to work in the semiconductor packaging field in a highly dynamic environment at the intersection of science and industry? And finally, are you interested in developing novel semiconductor packaging concepts?

If that is a triple YES, please contact us. We might be looking for you.

Your profile

Check whether you are the intern we would like to offer an assigment:

  • Interested in learning about manufacturing technologies for electronics packaging
  • Affinity with semiconductor packaging
  • Good communication skills in English
  • Independent, but also a team player

Contact

To learn more about what CITC can offer you, please contact one of our program managers:

Gari Arutinov, Program Manager Power Packaging
Francesca Chiappini, Program Manager RF Chip Packaging

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