Introducing PODIUM – Photonics Assembly Consortium
PRESS RELEASE | Nijmegen, December 15, 2020 – Today, Chip Integration Technology Center (CITC), Tegema, PI (Physik Instrumente) and PHIX released their new Photonics Assembly Consortium called PODIUM. The consortium is funded by PhotonDelta and CITC. The name PODIUM refers to PIC Open Development Infrastructure for Universal Markets.
PODIUM runs a program in which optical termination technology, assembly and packaging is developed for a wide range of integrated photonic applications. As a Key Enabling Technology, photonics is the driver in many relevant innovations. E.g. data communication – saving lots of energy – and medical technology – saving lives.
PODIUM: a unique ecosystem to accelerate and standardize the packaging of integrated photonics.
Click here for the full press release in English
Click here for the full press release in Dutch
Have a look at www.podiumpackaging.com
Watch the PODIUM video
For further information please contact:
Marco Koelink, Business Development Manager CITC