Introducing PODIUM – Photonics Assembly Consortium
December 15, 2020 – Press release – Today, Chip Integration Technology Center (CITC), Tegema, PI (Physik Instrumente) and PHIX released their new Photonics Assembly Consortium called PODIUM. The consortium is funded by PhotonDelta and CITC. The name PODIUM refers to PIC Open Development Infrastructure for Universal Markets.
PODIUM runs a program in which optical termination technology, assembly and packaging is developed for a wide range of integrated photonic applications. As a Key Enabling Technology, photonics is the driver in many relevant innovations. E.g. data communication – saving lots of energy – and medical technology – saving lives.
PODIUM: a unique ecosystem to accelerate and standardize the packaging of integrated photonics.
For further information please contact:
Marco Koelink, Business Development Manager CITC