Digital Package Manufacturing
With additive manufacturing (AM) technologies (both 2D and 3D) significantly maturing in recent years, AM tool boxes create an opportunity for new packaging concepts to be developed and manufactured with increased design freedom, reduced manufacturing complexity and at a lower cost. In this respect, CITC focuses on deployment of recent advancements in AM technologies for building chip packages or parts thereof.
Using relevant prototypes, CITC aims to demonstrate new types of chip packages built with AM. Furthermore, within the CITC ecosystem in collaboration with material and equipment companies, CITC aims to further evaluate and develop the possibility of AM for digital manufacturing of next-generation packages.