Replay Photonics, Power and RF Packaging Forum 2022 available

December 7, 2022 – On November 30, CITC and Yole Group organized the Photonics, Power and RF packaging forum. Nearly 170 participants registered and logged into the digital event. The replay is now available. Below we have listed the presentations and the start time of the sessions for your convenience.

Session 1 on Photonics packaging

Martin Schell from Fraunhofer Heinrich Hertz Institute
Hybrid photonic integration for communication, quantum and sensing, starts at 31:40

Andrew Robertson from Bay Photonics
Quantum enabling photonic packaging, starts at 59:13

Bob Conner from X-Celeprint
Micro transfer printing for compound semiconductor 3DHI microsystems, starts at 1:34:44

Daniel Lieske from AEMtec
High-accuracy placement for photonics and RF applications, starts at 2:05:58

Session 2 on RF packaging

Sander Bronckers and Ad Reniers from AntenneX
Making mm-Wave and sub-THz over-the-air characterization a reality, starts at 2:38:23

Gabriella Pereira from Yole Intelligence
RF SIP packaging market trends, starts at 3:10:03

Session 3 on Power packaging

Christina Dimarino from Viriginia Tech
Packaging and integration of advanced power semiconductors, starts at 3:43:31

Victor Veliadis from Power America
Accelerating SiC power electronics commercialization, starts at 4:15:39

Amine Allouche from Yole SystemPlus
Reverse technology and cost for power devices packaging, starts at 4:49:17