CITC develops packaging and integration technology for chips to provide solutions to societal challenges.
Future societal challenges relating to energy, healthcare, mobility and agriculture or food mean that increasing degrees of ‘smartness’ have to be built into products and services. As a key enabling technology, chips make this smartness possible. A smart and complex form of integration and packaging is required to combine all functionality into one package. This not only makes the device smarter but also smaller and cheaper. And above all, more energy-efficient.
Chip integration is regarded worldwide as the main challenge in the development of the next generation of semiconductor devices. A generation that opens doors to even smarter and more energy-efficient products. Chip integration goes much further than just traditional packaging (‘making a box around the chip’), and can really be seen as an integral part of the function of the device.
CITC offers answers to societal challenges for the following application domains: energy, mobility, communication, care and agro/ food.
CITC gives substance to economic opportunities and strengthens the already existing ecosystem of companies and knowledge institutions. This is done by sharing knowledge, developing talent and start-up support.
CITC runs research programs on specific topics in close collaboration with partners and customers. Customers can join these programs in open collaboration (joint innovation with multiple participants) in a non-competitive environment. In this way, CITC creates an ecosystem where IDMs, OEMs, material suppliers and equipment suppliers create added value by performing innovation throughout the whole value chain. Customers typically collaborate in multi-year program participation or customized project (contract research). Academic projects (MSc, PhD or post-doc) are also possible.