Solutions to societal challenges
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Chip integration is regarded worldwide as the main challenge in the development of the next generation of semiconductor devices. A generation that opens doors to even smarter and more energy-efficient products. Chip integration goes far beyond traditional packaging (‘making a box around the chip’), and can really be seen as an integral part of the device’s function.
CITC offers solutions to societal challenges in the following application domains: energy, mobility, communication, healthcare and agro/food.
CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. We do this through knowledge sharing, talent development and start-up support.
We run our research programs in close collaboration with partners and customers. Together with device manufacturers, equipment manufacturers, material suppliers and system integrators we work in pre-competitive joint innovation programs.