CITC works on technology that helps to provide answers to societal challenges. This is done for the following application domains: energy, mobility, communication, care and agro/food.
The relation of integration technology and energy is twofold:
- By integrating smart chips on a single package, energy consumption is reduced – e.g. by using photonics chips
- Advanced die attach technology enables chips to be used for high power applications – e.g. in solar, wind farms and electric vehicles. Here the main challenges lie in heat dissipation in the chips.
Electricity-driven cars (like Tesla) and buses (VDL) can only continue if ‘high-power’ chips are developed. These chips are capable of handling large energy-flows without high losses. Self-driving cars can’t communicate fast and safely without the 5G network. New and efficient chips are needed for the development of this network.
The future of communication is in connectivity. Technologies such as RF and antenna on chip or package play a key role in wifi, 5G and IoT. Relevant topics here are:
- Data transmission by sensors in microchip technology
- High bandwidth wireless communication
New chips enable ‘point-of-care’ solutions. Patients no longer need to visit a hospital, little devices can track and/or measure their health at home. Health & high-tech startup Enzyre developed an integrated chip (together with NXP and Sencio), enabling patients to autonomously perform coagulation tests.
The future of the agriculture and food sector lies in smart farming. Digital technologies like robotics and sensor technology play a crucial role in this future. Topics include:
- Data collection through sensors with microchip technology
- Precision agriculture through a combination of GPS, ICT and robotics