Vacancy Industrial PhD Position
The world we live in has many social challenges. Improving healthcare, renewable energy transition, make the world a safer place. Package and integration development for chips is the key to global innovation. At Chip Integration Technology Center (CITC) we currently have a vacancy for an Industrial Phd Position: Predictive reliability of Power Packages.
Vacancy Industrial PhD Position: Predictive reliability of Power Packages
TU Delft and CITC are jointly looking for a highly motivated PhD student to work in the field of semiconductor packaging in a highly dynamic environment on the crossroad of academia and industry. Are you interested in developing novel semiconductor packaging concepts and strategies to predict and monitor package reliability? If YES, than contact us at CITC or TU Delft as we are looking for YOU.
Department & Sections
CITC – ‘Chip Integration Technology Center’ – is the center that develops new chip integration (also called ‘Advanced Packaging’ or ‘Heterogeneous Integration’) technologies. The center is located in Nijmegen (on the Novio Tech Campus) and is a cooperation between Universities/ Research Institutes and companies. Industrial companies work together with TNO and TU Delft to develop new and innovative Chip Integration technologies.
The Electronic Components, Technology and Materials (ECTM) group from TU Delft, participating in CITC, offers a multi-disciplinary research environment, with a strong interaction with industry, on emerging materials, innovative microstructures and devices, and novel integration concepts for Health, Energy, Sensing & Environmental applications.
Location: CITC Nijmegen
Education level: MS in applied physics, electrical or mechanical engineering
There is a trend for semiconductor devices towards increased power levels, driving the application of Wide-Band Gap (WBG) semiconductors such as gallium nitride (GaN) and silicon carbide (SiC) in a semiconductor package. The increased power density imposes to more and more challenges with respect to thermal management and mechanical stresses in a package occurring at elevated temperatures. As the devices are typically assembled in a package with copper base substrate and the major concern in such kind of packages is the coefficient of thermal expansion (CTE) mismatch between substrate and semiconductor. Moreover, during operation, the device undergoes high junction temperature swings that peaks up to 500°C. Therefore, high-temperature stability and temperature-dependent material properties become critical to packaging materials. Power and WBG semiconductor mass commercialization depends on the success of determining reliable materials and processes for packaging improving the reliability of the existing and future WBG-based packaging. In particular, die attach (interconnect) appear to be a performance and reliability limiting factors, not yet allowing semiconductor power devices to operate at their full potential.
Addressing aforementioned technological challenges, the multidisciplinary team at CITC is focused on development of novel thermo-mechanical design strategies and device packaging platforms composed of low stress and high reliability rugged interconnects. It is essential to be able to predict and monitor reliability of such packaging concepts. In particular, being able to distinguish and understand failure mechanisms and modes occurring in a newly developed package would greatly facilitate development and commercialization of new generation, reliable power packages.
SiC multi-functional test chip is a novel test platform that can be used for harsh environment applications like next generation power modules. They can provide a reliable platform to investigate reliability tests such as high temperature power cycling tests in various packaging systems, and evaluate the functionality of power modules’ cooling systems. This project will result in creating a modular SiC test chip package with on-chip microheaters integrated with accurate temperature and stress sensors with stable behavior in high temperature range. Using SiC test chips would realize in-situ material/system characterization elevated temperatures up to 500℃ and above. Such innovative platform could serve as a predictive reliability vehicle for evaluation of newly developed platforms at CITC.
We are looking for an enthusiastic candidate holding a MSc degree in applied physics, electrical or mechanical engineering, willing to obtain PhD degree in the field of semiconductor packaging. You have a demonstrable interest in electronics packaging, including materials, structure design, processing technologies, reliability tests, etc. We expect creativity, flexibility, and the ability to co-operate within an interdisciplinary research group. Close collaboration with industrial partners is also an essential part of the project.
The following criteria will be used to evaluate potential candidates:
- Masters or equivalent in mathematics, electrical engineering, material science, computer science, or a related field
- Highly competitive academic record and outstanding performance at Bachelor’s and Master’s level (top 20% ranking during your BSc and MSc)
- Outstanding analytical skills
- Excellent communication skills, including good written and spoken English, as well as the ability to conduct independent scientific work
- Experience in machine learning algorithm development is highly advantageous for this project
Conditions of employment
You will be employed by TU Delft and located at CITC. TU Delft offers PhD candidates a 4-year contract, with an official go / no go progress assessment after one year. Salary and benefits are in accordance with the Collective Labor Agreement for Dutch Universities, increasing from € 2395 per month in the first year to € 3061 in the fourth year. As a PhD candidate you will be enrolled in the TU Delft Graduate School. The TU Delft Graduate School provides an inspiring research environment with an excellent team of supervisors, academic staff and a mentor. The Doctoral Education Program is aimed at developing your transferable, discipline-related and research skills. The TU Delft offers a customizable compensation package, discounts on health insurance and sport memberships, and a monthly work costs contribution. Flexible work schedules can be arranged. For international applicants we offer the Coming to NL Service and Partner Career Advice to assist you with your relocation.
To apply, please send an e-mail to firstname.lastname@example.org with the following information in English (pdf format only):
- Letter of motivation
- Curriculum vitae
- BSc and MSc grades
Application deadline: December 31, 2020
A pre-employment screening can be part of the application procedure.