Vacancy Thermal-Mechanical Simulation Engineer

The world we live in has many social challenges. Improving healthcare, renewable energy transition, make the world a safer place. Package and integration development for chips is the key to global innovation. At Chip Integration Technology Center (CITC) we are looking for a Thermal-Mechanical Simulation Engineer.

Vacancy Thermal-Mechanical Simulation Engineer


CITC – ‘Chip Integration Technology Center’ – is the center that develops new chip integration (also called ‘Advanced Packaging’ or ‘Heterogeneous Integration’) technologies. The center is located in Nijmegen (on the Novio Tech Campus) and is a cooperation between Universities/ Research Institutes and companies. Both OEM, IDM and packaging services companies work together with TNO and TU Delft to develop new and innovative Chip Integration technologies. We are currently looking for a Thermal-Mechanical Simulation Engineer (full time).

Location – CITC, Nijmegen
Experience level – Several years of work experience in R&D research or industrial environment
Education level – MS/ PhD

Job description
Would you like to join a talented and passionate team at a new R&D center in the field of chip integration, engaging with leading industries in automotive, healthcare technology and other high-tech sectors? Then you are welcome at CITC in Nijmegen. We are currently looking for a thermal-mechanical simulation engineer to strengthen our international team. You will be working at the interface of materials science, process technology, microelectronics and packaging in a multidisciplinary research environment, together with the industry.

Your Responsibilities

  • Thermal and mechanical modeling of high-performance power dies from die to package-level.
  • Simulation of innovative die attach and packaging concepts for a next generation power and RF devices.
  • Thermal-mechanical modelling for RF packaging, in particular for Antenna-In-Package architectures.
  • Co-design methodologies to combine RF and thermal-mechanical aspects, working in close collaborations with RF and antenna designers.
  • Analysis of simulation results to define package design requirements.
  • Participate with expertise and take responsibility in ongoing collaborative projects with international customers.
  • Interaction with our industrial partners and customers on a day-to-day basis.
  • Supervision of students.

Your Profile

  • MS in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field;
  • 3+ years of direct hands-on experience in thermal/mechanical modeling in a related R&D or high-tech industry;
  • Expert knowledge of major thermal and structural tools, e.g., ANSYS, ABAQUS, COMSOL or similar;
  • In-depth knowledge in thermal/mechanical modeling of advanced packaging, with primary focus on die attach/interconnect reliability, at all levels – die to system and/or package thermomechanical integrity (e.g. warpage simulations);
  • Understanding of microelectronics reliability testing;
  • Proven creativity through a strong list of publications, patent applications and/or other tangible output;
  • Flexible, adaptive capacity and perseverance;
  • A pro-active and hands-on mentality, taking responsibility and organizing work in an efficient manner;
  • Excellent team player;
  • Good verbal and written communication skills in English.

More information & Application
To apply please sent your resume and motivation to For more information contact Chris Geelen HIP BV via +31(0)615132169.

Acquisition in response to this vacancy is not appreciated. Candidates introduced by agencies without prior agreement on the terms will not be taken into consideration. No rights can be derived from this.

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