Besides our own lab facilities, we have access to the lab facilities of several TNO locations and Delft University of Technology, primarily for wafer-level processes.
This includes the facilities of TNO Holst Centre in Eindhoven and the Else Kooi Lab of Delft University of Technology.

Back-end assembly
Located at CITC, Noviotech Campus in Nijmegen
- Access to all processes for lead frame packaging
- Flexible labs for high-mix, low-volume assemblies
- Die/clip attach expertise in pressure-less sintering and soldering

Equipment available for
- Material deposition
- Pick and place
- Sintering and reflow
- Wire bonding
- Wafer dicing and laser cutting
- Molding and cleaning
- Optical alignment
Advanced packaging line
Located at TNO Holst Centre, High Tech Campus in Eindhoven
- Compatible with 352x320 mm panels and smaller, including wafers, temporary bonding, and mechanical and laser debonding
- Access to spin and slot die coating, maskless and SCIL imprint lithography, metallization (sputtering/e-beam), PVD, CVD, RIE and barrel plasma etching
- Roll and vacuum lamination
- Access to new tooling concepts like Impulse Printing®

Available equipment
- Advanced panel packaging line
- Impulse printing, laser die transfer

Testing and analysis
Located at CITC, Noviotech Campus in Nijmegen
- Access to standard characterization for lead frame packaging
- Non-destructive and destructive testing
- Perform thermal and electrical testing
- Reliability testing; thermal cycling and shock

Equipment available for
- Non-destructive inspection
- Optical inspection
- Cross-sectioning/Scanning Electronic Microscopy
- Electrical and thermal testing
- Reliability testing
- Mechanical testing
TNO testing and analysis equipment
Located at several TNO locations in the Netherlands
- Chemical labs with access to DTMA, TGA, rheology, etc.
- Metrology for advanced packaging like SEM and TEM
- RF characterization at specialized RF department
