Programs

CITC's expertise is focused on two research program lines and one educational program.

Bare die on printed circuit board

Power packaging

CITC's power packaging program concentrates on developing novel thermo-mechanical design strategies and device platforms.

RF and mmWave

CITC develops technologies to enable the next generation of mmWave applications. Our focus is on antenna-in-package architectures.

Education

CITC's Semiconductor Packaging Program offers its participants a deep dive in the final step of chip manufacturing.