News

And it’s a wrap! With the final presentation on quality and smart manufacturing, this year’s edition of the Semiconductor Packaging program has come to an end.

A full house today for the start of the CITC Semiconductor Packaging Program! Thirty participants  have enrolled in the seventh edition of this comprehensive program.

CITC participates in the CONNECT GLD consortium which aims to produce the next generation of chips using less material and consuming less energy.

TANAKA Precious Metal Technologies Co., Ltd. has partnered with CITC/TNO to advance research and development in next-generation semiconductor packaging technologies.

A very warm welcome to our new interns: Aaron Laviada Lopez and Anirdesh Yalamarthi.

CITC brought a whole range of chip packages, leadframes, and demo units to the Nijmegen Technology Day.

CITC's student Subba Vemula shared the results of his research into the performance evaluation of pressureless copper sinter paste.

CITC is proud to present its entirely in-house designed and developed clip packaging platform.

We celebrated the successful closure of the first research collaboration between Vishay Intertechnology, Inc. and CITC/TNO.