Issueing certificates Semiconductor Packaging University Program News

Certificates for Semiconductor Packaging students

October 15, 2021 – On October 11, the first students of the Semiconductor Packaging […]

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Photonic Integration Conference News

Recap of Photonic Integration Conference

October 13, 2021 – Over 35 participants from all over the world attended the online […]

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Wissam at work News

CITC and MSC Software support the next generation of chip integration… and its creators

October 11, 2021 – As an open innovation center, CITC collaborates with many organizations. […]

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Introduction Semiconductor Packaging University Program by Barry Peet News

Second edition Semiconductor Packaging University Program kicked off

September 1, 2021 – On August 30, the second edition of the Semiconductor Packaging […]

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Aeneas - Engage in the Digital Future News

CITC joins AENEAS

August 12, 2021 – As of July 1, CITC is a member of AENEAS, […]

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First graduate Semiconductor Packaging program News

First graduate Semiconductor Packaging minor

June 28, 2021 – CITC is proud to have its first student graduate the […]

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CITC 2020 results infographic News

Reflections on our first year: check out the CITC results infographic

June 24, 2021 – Getting close to our second birthday, CITC reflects on the […]

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CITC in BLIQ movie News

BLIQ and CITC offer a new look at tech

June 24, 2021 – Promoting technical education and a future in tech is important […]

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CITC at Innovate MeetUp News

Let’s explain how CITC enables 5G

June 14, 2021 – CITC is proud to be part of the 7th Innovate […]

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Foto WB 2 News

Mintres and diamond: CITC’s best friends in thermal-management

May 3, 2021 – Efficient thermal-management is an ongoing challenge in electronics and opto-electronics. […]

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TNO-Lepus Next Generation_EDV6507 (Large) bijgesneden News

CITC and AMSYSTEMS combine expertise to accelerate 3D printing innovation

April 26, 2021 – CITC assisted AMSYSTEMS in validating future production technology that is […]

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_FOW5841 News

CITC educates next generation of high-tech talent

April 1, 2021 – Together with HAN University of Applied Sciences, Chip Integration Technology […]

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