A very warm welcome to our new interns: Aaron Laviada Lopez and Anirdesh Yalamarthi.
CITC brought a whole range of chip packages, leadframes, and demo units to the Nijmegen Technology Day.
CITC's student Subba Vemula shared the results of his research into the performance evaluation of pressureless copper sinter paste.
CITC is proud to present its entirely in-house designed and developed clip packaging platform.
We celebrated the successful closure of the first research collaboration between Vishay Intertechnology, Inc. and CITC/TNO.
CITC will perform reliability tests on the first QFN samples utilizing a new pressure-less sintering material as die attach.
June 15 was the day of the chip exhibit presentations at Mondial College. And they did not disappoint!
Registration for the 2026 edition of the CITC Semiconductor Packaging Program has now begun.
Eleven young students visited CITC and were introduced to research into semiconductor packaging.
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