Core Activities

CITC is a joint innovation center that specializes in heterogeneous integration and advanced packaging. As core activities we offer:

Photonica – Smart Photonics

Access to Innovation

Organizing and executing innovation programs in the field of packaging and integration technology for chips. Currently CITC has four program lines. Read more


Access to Infrastructure

CITC maintains lab facilities that support the innovation programs and also support the education programs through internships and MSc/PhD programs. CITC has a Smart Industry Field Lab status, indicating that it is a place where industry and research organizations jointly develop, test and implement smart industry solutions. Read more


Access to Education

CITC collaborates with universities, applied universities and companies to support and provide packaging and chip integration technology related education. This includes internships, MSc/PhD programs and a specific CITC – HAN Semiconductor Packaging module. Read more

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