Semiconductor Packaging University Program

Together with HAN University of Applied Sciences, CITC developed the Semiconductor Packaging University Program. The program is offered as a minor to students and focuses on the design and manufacturing of semiconductor packages. It includes practical assignments that are completed on the premises of CITC and several semiconductor companies in our netwerk. The program is also accessible to semiconductor staff who’d like to stay up to date with the latest developments in the industry.

Integrated chip technology and its applications

Semiconductor packagingYou will get acquainted with the semiconductor industry and delve into the final step of chip manufacturing. This is the phase in which the chip is packaged in its housing. Packages are becoming more complicated and application specific, while costs must be kept low. Developments such as system-on-chip, embedded cameras, 5G, sensors and micro-electro-mechanical systems place high demands on the manufacturing process and the competencies of employees.  The program focuses on the design and manufacturing of semiconductor packages and the associated assembly, reliability and test techniques.


Program content

The theoretical lessons take place on Mondays from 12:30 hrs to 21:00 hrs (CET). Topics that are covered include:

  • Semiconductor front-end introduction
  • Semiconductor back-end introduction
  • Application areas and requirements, advanced packaging technologies
  • Packaging of integrated photonics introduction, reliability
  • Thermal and mechanical simulations
  • Advanced materials introduction, quality
  • Semiconductor testing, trends in semiconductor packaging

The practical lessons will be scheduled after the completion of the theoretical part.

For whom

The program is offered:

  • As a course for professionals working or interested in the semiconductor industry, who want to expand or deepen their knowledge of semiconductor assembly and packaging.
  • As a minor for bachelor students Electrical and Electronic Engineering, Applied Physics, Chemistry, Mechanical Engineering, Automotive Engineering, or Industrial Engineering & Management, who want to broaden their horizon into the field of semiconductor assembly and packaging.

Minor for students

In the minor you delve into the world of semiconductors and chip packaging for e.g. embedded cameras and sensors. Topics covered in the minor are:

  • Semiconductors and semiconductor packaging fundamentals
  • Advanced applications, materials and packaging techniques
  • Basic package simulations, device testing and data analysis
  • Design quality and reliability, industrialization and economics

It is a block minor, offered once a year as a block in the first semester. As a differentiation exchange course, the minor enables you to develop your professional competences in a different/broader context. The study format is either full-time or part-time during one semester. After completion, you will receive a certificate or proof that it is part of your bachelor degree. Title and level are Bachelor – University of Applied Sciences.

More info for students

Practical details

  • Location: CITC, Novio Tech Campus, Transistorweg 5, Nijmegen, the Netherlands
  • Language: English
  • Start date: first week of September
  • Format:
    • Part-time, about 5 months
    • Theoretical part: both on site and online
    • Practical part: on site
  • Study load: ± 20-24 hours per week (lectures + self-study)
  • Costs
    • Study material: € 200
    • Option 1: stand-alone course, theoretical part only: € 2,750 excl. VAT (VAT is not applicable for private participants)
    • Option 2: stand-alone course, both theoretical and practical part: € 3.750 excl. VAT (VAT is not applicable for private participants)
    • Option 3: as part of a HAN bachelor program check out the costs here

Interested?

Are you interested in joining this course? Please contact us for more information or to receive the registration form. You will find more details in the Semiconductor Packaging University Program brochure

Looking back at the first edition of the course

In October 2020, RN7 and Omroep Gelderland published a news item about the Semiconductor Packaging course. Read more or watch the video for the interview with Joop Bruines, education consultant and Gwen Visser, student.

The Semiconductor Packaging University Porgram is supported by

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