Thermal High-Performance Packaging

There is a trend towards increased power generation by semiconductor devices, due to factors including the move to Wide-Band Gap (WBG) materials, such as gallium nitride (GaN) and silicon carbide (SiC). To be able to validate significantly  higher material costs, new devices based on WBG materials require high performance modules to take all the benefit from their performance. Power packaging is now a key field of investigation for improvement, as high operating temperature and switching frequencies enabled by WBG devices create more and more challenges when it comes to power dissipation and mitigation of thermomechanical stresses.

In this respect, successfully determining which materials and processes are reliable for packaging is crucial to the mass commercialization of power and WBG semiconductors and will help improve the reliability of existing and future WBG-based packaging. In particular, die attach and molding appear to be performance and reliability-limiting factors, which do not yet allow semiconductor power devices to operate at their full potential. Addressing the aforementioned technological challenges, one of CITC’s primary focuses within the Thermal High-Performance Packaging Program is the development of novel thermo-mechanical design strategies and device packaging platforms composed of low-stress and high-reliability rugged interconnects and molds with high power dissipation capability.

Thermal High-Performance Packaging

At CITC we have developed multidisciplinary competence and state-of-the-art packaging infrastructure, including:

  • material characterization, thermomechanical simulations and assembly expertise,
  • fully equipped back-end assembly and integration capability for building own Proof of Concept packages,
  • standard reliability and testing infrastructure as well as unique system for early failure detection and monitoring.

CITC has demonstrated capability of building robust high power packages (PQFN and ACP) using SOTA pressureless sintering die attach materials and novel thermo-mechanical package design concepts.