Access to Innovation

Organizing and executing innovation programs in the field of packaging and integration technology for chips.

 

Innovation center focus areas

Joint Innovation Center

CITC is a joint innovation center where companies, research and educational institutes work together on integration and packaging technology. Chip integration and packaging technology includes challenges such as those presented by placing more and more chips and functions in a single package (also called ‘System in Package’ or ‘SiP’), high performance die-attach materials for power electronics and design and material characterization for RF devices. Therefore CITC brings device manufacturers (IDM), equipment manufacturers (OEM), material suppliers and system integrators together in pre-competitive joint innovation programs.

Program Lines to develop prototype chip packages

Program Lines

Currently CITC has four program lines. With a yearly cycle of development within these program lines, based on the company inputs, CITC will demonstrate prototype chip packages and work on ensuring relevance and direct deployable results.

Thermal High-Performance Packaging
RF Chip Packaging
Digital Package Manufacturing
Integrated Photonics Packaging

Innovation areas

Way of Working

CITC runs research programs on specific topics in close collaboration with partners and customers. Customers can join these programs through open collaboration (joint innovation with multiple participants) in a non-competitive environment.
In this way, CITC creates an ecosystem where device manufacturers (IDM), equipment manufacturers (OEM), material suppliers and system integrators create added value by innovating throughout the value chain. Customers’ collaboration typically takes the form of multi-year program participation or a customized project (contract research). Academic projects (MSc, PhD or post-doc) are also possible.

chip package innovation

Advantages of Joint Innovation

CITC brings IDMs, OEMs, material suppliers and system integrators together in pre-competitive joint innovation programs. Sharing of competencies and facilities is maximized, while the costs are optimized and public funds can be added. Early involvement of material and equipment suppliers gives the opportunity to design better application-specific solutions that may lead to de facto new industry standards.
This collaborative approach reduces the time to market and risks through a joint pre-competitive technology roadmap. All partners create a unique ecosystem around defined clusters of innovation and a strong global value chain.