RF Chip Packaging
A current trend for communication and automotive applications is a shift towards operating frequency in the mm-Wave domain. This drives the need to integrate more functionalities into the packages. Antenna-in-Package (AiP) architectures are adopted for many devices in order to reduce losses, improve the performance and reduce costs.
Within an AiP system, different elements such as antenna’s, IC’s, passive components and RF elements are integrated within one package. This high level of integration poses several technological challenges and calls for new solutions for, among others, low-losses interconnect, EM shielding and antenna integration.
The RF Chip Packaging program of CITC focuses on the development of mm-Wave packaging solutions, advancing the current package approaches and the underlying technologies. We apply a holistic approach where co-design methodologies and prediction models, expertise on packaging manufacturing technologies and materials are combined.
At CITC we have developed multidisciplinary competence and a state-of-the-art packaging infrastructure, including:
- RF and antenna design and simulations
- Thermomechanical modelling
- Fully equipped back-end assembly and integration capability for building own Proof of Concept packages and clean room processing for advanced packaging processes
- Additive manufacturing technologies for RF packaging applications
- Characterization methods for dielectric properties of packaging materials