RF Chip Packaging
A large number of new high-volume applications, especially in the mobile and automotive sectors, are moving towards the mmWave frequency domain. These applications drive the need to integrate new functionalities into the package, including mmWave die-to-board connections, waveguide launchers and antennas. This higher level of integration poses many technological challenges and calls for new solutions for low-loss interconnect, EM shielding and antenna integration, among other things. Furthemore, the packaging for mmWave devices must meet the miniaturizing requirements imposed by mobile applications or comply with the stringent reliability standards for the automotive domain.
CITC’s RF Chip Packaging program focuses on the development of mmWave integrated solutions including the development of Antenna in Package (AiP) concepts, advancing the current package approaches and the underlying technologies. This is done using co-design methodologies and prediction models combining expertise on antenna and RF design, packaging manufacturing technologies and materials.