Internships

One of CITC’s core values is access to education. Education and training are key to securing the future of the semiconductor industry in Europe. In close cooperation with companies and educational institutes, CITC organizes targeted education and training for young talent. By providing a connection between education and industry, we contribute to the training and skills of people who match industry needs.

Chip package mock up

Student opportunities

CITC holds an Accredited Work Placement Company qualification that enables us to train secondary vocational education (mbo) students in professional practice.

With our close ties to educational institutes like Radboud University, Delft University of Technology, Eindhoven University of Technology, University of Twente and HAN University of Applied Sciences, we regularly offer internships (BSc and MSc), graduation assignments (BSc and MSc) and PhD projects to students.

Internships or graduation assignments at CITC can last 3-9 months, the location is Nijmegen.

Graduation assignment

Check if you’re a match for CITC

Are you a motivated and enthusiastic student in one of the following fields:

  • Electricial engineering
  • Mechanical engineering
  • Applied physics
  • Material Science
  • International Business

Are you willing to work in the semiconductor packaging field in a highly dynamic environment at the intersection of science and industry?

And, finally, are you interested in developing novel semiconductor packaging concepts?

If this is a triple ‘YES’, please contact us. We might be looking for you!

Current opportunities

Internship assignment video communication (in Dutch)

Within our content marketing an essential part is missing: video. Although we have a corporate film, we are convinced that other forms of video content – from trade fair presentation to vlog – can be of value to CITC. The main task of the intern we are looking for is to map out the possibilities of video communication for CITC.
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Graduation assignment (MSc): Interpretation of CSAM images using deep learning in the semiconductor packaging industry

CITC would like to study the potential of machine learning to lead to new innovations within the semiconductor industry. This specific project concerns automated classification and predictive failure analysis on CSAM (Confocal Scanning Acoustic Microscopy) images with deep learning technology. A dataset of about 100 images, of which 25 including cross-sectional analyses, is currently available and can be further extended if needed.

In case of interest or questions, please contact Sebastien Libon


Internship/graduation assignment: Antenna design and simulations for Antenna-in-Package applications

You are a motivated and enthusiastic student in Electrical engineering or Applied physics with an affinity for electromagnetic simulations. You have good communication skills in English and you are independent, but also a team player. You are interested in performing electromagnetic simulations of innovative RF and antenna systems and in learning about manufacturing technologies for electronics packaging. This internship/graduation assignment has a duration of 3-9 months.
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Interested in an assignment at CITC?

To learn more about what CITC can offer you, please fill in the student contact form or contact our internship coordinator Francesca Chiappini, Program Manager RF Packaging.

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