Chip Integration Technology Center (CITC) is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging.
CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes work together in developing a new generation of chip packages.
Within the world of semiconductors and photonics, integration and packaging technology is growing in importance. The cost and performance for advanced devices are increasingly dominated by integration and packaging challenges. Innovative industrial solutions will be key for the development of new advanced devices in solving several societal challenges.
CITC brings leading industrial innovations in integration and packaging technology to the market in a selected and growing number of application areas. We create an effective ecosystem with customers, suppliers and other stakeholders. We develop and lead relevant research programs, pursue knowledge creation and sharing and stimulate business initiatives.