Publications
Welcome to our publications section. Here you will find:
- CITC brochures
- Articles published by CITC
- Articles published by third parties
- Scientific literature related to CITC’s program lines
CITC press releases are included in our News section.
Articles published by CITC
- CITC results infographic 2021 (EN)
- CITC results infographic 2021 (NL)
- Pressure-less encapsulation for pressure and temperature sensors using Additive Manufacturing (LinkedIn, August 10, 2021)
- How to characterize the dielectric properties of electronic packaging materials (whitepaper, March 2021)
- CITC results infographic 2020 (EN)
- CITC results infographic 2020 (NL)
Articles published by third parties
2022
- CITC and AntenneX are already working on technology of 2032: 6G (Novio Tech Campus, March 8, 2022)
- CITC and AntenneX join forces to characterize antenna-in-package applications at mmWave frequencies (Novio Tech Campus, January 24, 2022)
2021
- The whole chip technology chain should be present in Europe – (Novio Tech Campus, December 2, 2021)
- Superdunne chips maken, en dan stapelen (Het Financieele Dagblad, November 11, 2021)
- Power and RF should be priorities for European collaboration in chips (Bits&Chips, September 2021)
- Semiconductor Packaging University Program – Edition 2021-2022 (Novio Tech Campus, September 1, 2021)
- Nieuwe opleiding halfgeleiderindustrie (Innovation Origins, August, 6, 2021)
- Delve into the world of semiconductors and chip packaging! (HAN blog, April 4, 2021)
- CITC: educating the next generation of high-tech talent (Novio Tech Campus, April 1, 2021)
2020
- CITC lanceert Photonics Assembly Consortium PODIUM (Novio Tech Campus, December 17, 2020)
- Unieke Semiconductor Packaging opleiding gestart (Novio Tech Campus, September 30, 2020)
- CITC en Yole Développement organiseren virtuele forums over Power en RF Packaging (Novio Tech Campus, August 13, 2020)
- CITC and HAN course taps into increasing chip packaging complexity (Bits&Chips, July 16, 2020)
- CITC ontwikkelt Semiconductor Packaging University Program (Novio Tech Campus, July 1, 2020)
- The summit of data hunger is rising, here’s how to conquer it (PI Micro Talk, June 30, 2020)
- Taking off might have been the easy part for CITC (Bits&Chips, April 20, 2020)
- Elektrotechniek = de wereld van robots, chips en bits (De Gelderlander, March 7, 2020)
- Kennisontwikkeling vereist groter denken en lange adem (IN2 Maas&Waal, March 3, 2020)
- CITC vol ambitieuze plannen voor 2020 (Novio Tech Campus, January, 7, 2020)
Literature related to CITC's program lines
Thermal High-Performance Packaging
2019
- ATE-Experimental evaluation of a compact two-phase cooling system for high heat flux… (September 2019)
- Design, fabrication and characterization of MEMS based micro heater for vaporizing liquid… (June 2019)
- Lab-on-a-chip for individual cell response to light stimulation (June 2019)
- MEMS Switches by Carbon Nanotubes with Silicon Carbide Coating (June 2019)
- MS thesis Alisher Kurmanbay 2019 (June 2019)
- Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics (June 2019)
- Multi-functional LED Module Integration and Miniaturization for Solid State Lighting Applications (January 2019)
- Effects of sintering pressure on the densification and mechanical properties of nanosilver… (2019)
2018
- Wafer Level Through-polymer Optical Vias (September 2018)
- A new experimental approach to investigate the physics-of-failure of wirebond interconnects (August 2018)
2017
- Fabrication and characterisation of high aspect ratio MEMS electrochemical sensor (November 2017)
- Investigation on Viscoplastic Properties of Au-Sn Die-attach Solder (October 2017)
- Solid State Lighting Color Shift (September 2017)
- The Lifetime Prediction of LED Drivers and Lamps (September 2017)
- Carbon nanotube based solutions for on-chip thermal management (July 2017)
- Nano-copper paste filled vertical interconnects (June 2017)
- Monolithic 3D Wafer Level Integration (January 2017)
2016
- Flexible Interposer Based on Carbon Nanotubes and PDMS Composite (December 2016)
- Wafer Level Packaging With Nano Metal Paste Interconnects For UV-C LEDs (December 2016)
- A Miniaturized Temperature Controlled Capacitive MEMS Transducer for MOF based Gas… (October 2016)
- Optical degradation mechanisms and accelerated reliability evaluation for LEDs (September 2016)
- System in package for intelligent lighting and sensing applications (September 2016)
- Multi-Scale Material and Technology for Heterogeneous Integration (January 2016)
2015
- Flexible Interposer Based on Carbon Nanotubes and PDMS Composite (November 2015)
- Organic Materials Degradation in Solid State Lighting Applications (November 2015)
- Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration (October 2015)
- Thermally Driven Sound Source (September 2015)
- Fast Qualification of Solder Reliability in Solid-state Lighting System (April 2015)
2014
- Low temperature fine pitch vertical wafer level interconnection using copper nanoparticles (November 2014)
- Monolithic integration of light sensor readout system for multi-functional LED wafer-level… (November 2014)
- Monolithic Integration of Rectifiers and Drivers for low power SSL applications on a Rigid to… (November 2014)
- A Systematic Approach to Address the Reliability of Solid State Lighting Drivers (September 2014)
- Thermal management of solid state lighting module (September 2014)
2013
- Foldable 3D Wafer Level SSL Package Using Flexible Interconnect (December 2013)
- Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D Interconnect… (October 2013)