Currently CITC has four program lines and one education program.

Program Lines to develop prototype chip packages

With a yearly cycle of development within the program lines CITC will demonstrate prototype chip packages and work on ensuring relevance and direct deployable results.

Thermal High-Performance Packaging
RF Chip Packaging
Digital Package Manufacturing
Integrated Photonics Packaging

Knipsel LinkedIn 2

Semiconductor Packaging University Program

Together with HAN University of Applied Sciences, CITC developed a Semiconductor Packaging University Program (Minor) tailored to the specific needs of the companies involved. This course, with a duration of about 5 months, enables both students and company employees to get training in all relevant aspects in the field of packaging, both theoretical and practical. The course includes a practical assignment that will be carried out on the premises of either a Semiconductor company or CITC. Start date is September. Interested to join? Please let us know.

Read more
Download brochure

Share via
Copy link
Powered by Social Snap