At present, CITC has four research program lines and one education program.
Access to innovation
CITC runs its research programs in close collaboration with partners and customers. Our research efforts are focused on four program lines.
Thermal High-Performance Packaging
RF Chip Packaging
Additive Packaging Manufacturing
Integrated Photonics Packaging
Semiconductor Packaging University Program
Together with HAN University of Applied Sciences, CITC developed the Semiconductor Packaging University Program. The program provides a connection between education and industry and as such contributes to the training and skills of people that align with industry needs.