Integrated Photonics Packaging
Today, developments in photonic integrated circuits open up new functionalities and applications. Packaging and assembly technologies are crucial to make devices available for high-volume and low-cost applications. This includes heterogeneous integration: the dense integration of compound semiconductor photonics and silicon microelectronics. It allows for significant reductions in system size, weight and power, while simultaneously yielding performance improvements and new functionality.
Specifically, photonics merged with microelectronics is a key enabler for smarter photonics and faster electronics and is crucial for novel applications in the automotive (Lidar), medical and data communications (including Lifi) fields and many others. CITC will address topics such as thermal management, high I/O chip-to-chip interconnect, chip-to-chip alignment reliability and cost related to the integration of photonics with microelectronics or other microsystems. These developments will be supported with advanced modelling and simulations to optimize material choices and process flows.