Programs
CITC's advanced chip packaging expertise is focused on three research program lines and one educational program.
Power packaging
CITC's power packaging program concentrates on developing novel thermo-mechanical design strategies and device platforms.
RF and mmWave packaging
CITC develops technologies to enable the next generation of mmWave applications. Our focus is on antenna-in-package architectures.
Integrated photonics packaging
In our Integrated Photonics Packaging program, CITC supports customers with their chip packages and develop new packaging concepts.
Packaging education
CITC's Semiconductor Packaging Program offers its participants a deep dive in the final step of chip manufacturing.
Publications
Our researchers and PhD candidates regularly publish their findings in scientific magazines. We have compiled an overview of CITC's scientific publications over the years.