Integrated Photonics Packaging

Photonic Integrated Circuits (PICs) are an emerging technology in data communications, optical computing and sensing. In our Integrated Photonics Packaging program, we support customers with their chip packages and develop new packaging concepts.

We aim to ‘semiconductorize’ the integrated photonics industry. We do this by using our expertise and knowledge in the field of high-power electronics packaging and RF packaging to develop packaging technologies that address the following topics:

  • Fiber-to-chip coupling
  • Chip-to-chip coupling
  • High-density electrical and optical interconnections
  • Hybrid integration of photonics chips
  • Multi-chip module in which photonics and electronics are integrated in a single package
  • Thermal management
Artisitic picture of a photonics demonstrator

Heterogeneous and hybrid integration

Packaging and assembly technologies are critical to making devices available for high-volume, low-cost applications. This includes heterogeneous and hybrid integration: the dense integration of compound semiconductor photonics and silicon microelectronics. It enables significant reductions in system size, weight and power, while delivering performance improvements and new functionality.

Specifically, the combination of photonics with microelectronics is an important factor for smarter photonics and faster electronics. It is crucial for new applications in e.g. the automotive, medical, optical computing and data communications fields.

Photonic alignment

6-axis active alignment: PI Nanocuble on Etteplan platform

State-of-the-art infrastructure

CITC has a state-of-the-art assembly facility for active and passive alignment for photonic devices. This is further complemented with advanced semiconductor capabilities, such as:

  • Die attach by dispensing either (conductive) adhesive, solder or sinter die attach materials
  • (RF) wire bonding, adhesive bonding, soldering and sintering capabilities
  • Flip chip bonding
  • Die attach underfill

Working with CITC

  • We are experienced in both semiconductor and photonics packaging, which includes e.g. thermal optimization and RF
  • We provide you with all results in process development, process optimization and statistical process control
  • We participate in research programs, e.g. in defining new standards in photonic packaging

CITC photonics ecosystem

Evolving photonics technology is not a one-man business. Collaboration is vitally important in innovation. CITC therefore collaborates with several organizations such as:

We are also active in the Dutch Growth Fund related to Photonics. Within this project, we develop future packaging solutions to reduce packaging costs and improve performance.

PODIUM: Photonics Assembly Consortium

CITC is part of the PODIUM photonics assembly consortium that combines the electrical and optical packaging know-how of its partners to accelerate assembly process development and provide an efficient path to volume production.

PODIUM runs a program in which optical technology, assembly and packaging is developed for a wide range of integrated photonics applications.

Partners

The whole is greater than the sums of its parts – get to know the PODIUM partners in more detail:

  • CITC – joint innovation center specializing in heterogeneous and hybrid integration and advanced chip packaging technology
  • Etteplan – multidisciplinary system integrator who combines its experience in customized precision mechanics and mechatronics with the latest robotics, software, and big data technologies to optimize production performance
  • Finetech – leading equipment manufacturer for sub-micron die and flip-chip bnding with a strong customer base in the photonics markets
  • PHIX – fully independent foundry for packaging and assembly of Photonic Integrated Circuits in scalable production volumes, supporting all major technology platforms
  • PI (Physik Instrumente) – market and technology leader for high-precision positioning technology and piezo applications in the semiconductor industry and photonics

Watch the PODIUM video

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