Wissam Assaad – Thermo-mechanical simulation engineer
Wissam’s research interests lie in physical modelling and simulations in different domains, i.e. metal forming, material characterization, pressure wave propagation, structural dynamics, frictional heating and biomedical. He has a strong academic background: a BE in mechanical engineering, an MSc in simulation techniques in mechanical engineering and a PhD in nonlinear solid mechanics – aluminium extrusion with a deformable die. He has authored 12 technical papers and holds 5 patents.
Joop Bruines – Education Consultant
Joop holds a PhD in Physics and has a long engineering and managerial background in both the Electronic and the Photonic Integrated Circuits industry. He always played an active role in talent development, university relations, and technology promotion programs. Now, he deploys his acquired experience and professional network for CITC. Joop also holds a part-time position at the HAN University of Applied Sciences as Semiconductor Packaging University Program developer.
Francesca Chiappini – Program Manager RF Chip Packaging
Francesca is our Program Manager for the RF Chip Packaging Program. She has a background in physics and she has experience with open innovation in the domain of hybrid integration for printed electronics. Within the RF Chip Packaging program, Francesca works in a multidisciplinary team with expertise in packaging technology, RF and antenna design and material science.
Sander Dorrestein – Senior Micro-Electronic Packaging Engineer
Sander is Micro-electronic Packaging Process Engineer at TNO and started working for CITC per May 1, 2020. He will be mainly active in the Thermal High-Performance Packaging program. Sander is a mechanical engineer with special interest in micro-assembly processes and technologies. He has a broad experience in the field of bonding and joining applications for both micro-electrical and micro-optical packaging. He has a proven track record of developing bonding and joining processes which are currently used in production for consumer, medical, industrial and automotive applications.
Jacqueline van Driel – Project Leader
Jacqueline is Project Leader at TNO and as of July 2021 at CITC. In this position, she will be managing multiple projects within CITC. She holds a PhD in Physics from the University of Amsterdam. She has a broad experience as a project manager, product developer and researcher in topics such as scanning probe microscopy, replication of optics on (glass) wafers, thermal management in household appliances, electronic textiles and more.
Paola Andrea Escobari Vargas – Professional Doctorate Engineering Trainee
After studying Electronics Engineering at the Higher University of San Andrés in La Paz, Bolivia, Paola pursued a master’s degree in RF and Microwave Engineering at the University of Surrey in the United Kingdom. She used to work for the Bolivian Space Agency as a Ground segment engineer. At CITC, she works on the design of an AiP and filter chip for 5G applications using conventional packaging technologies and novel 3D printing.
Tine Geerits – Office Manager
Tine started January 2020 at CITC. She is the person that makes sure everything runs smoothly in the office. Her knowledge and experience lie in supporting organizations, teaching and coaching.
Victoria Gomez-Guillamon Buendia – IC Antenna Designer
Victoria is an Antenna Scientist Innovator at TNO working on the antenna-in-package program for CITC. She has a PhD in Electrical Engineering from Heriot-Watt University (Edinburgh, United Kingdom) and a strong background in electromagnetism and antenna design. She is within the Radar Technology group and focuses on antennas for 5G/6G applications.
Peter Harmsma – Integrated Photonics Program Manager
Peter is an expert in integrated photonics, with experience in design, manufacturing and testing in silicon photonics and indium phosphide. He received a PhD at the Delft University of Technology in 2000, and worked on the development of InP photonic receiver modules as a co-founder of ThreeFive Photonics. As a scientist at TNO, his focus has been on photonic sensor systems and applications. At CITC, he is the (interim) program manager of the Integrated Photonics Packaging program.
Martien Kengen – Lab and Assembly Process Manager
With an academic background in physics and his knowledge of most assembly processes, especially in wire bonding, Martien is our experienced Lab and Assembly Process Manager. Martien started at CITC in January 2020, setting up the assembly and lab equipment.
Christian Ketelaars – Marketing & Communications Officer
Christian is a marketing communicator with over 20 years of experience in the tech sector. She knows what it takes to successfully set up and manage marketing and communication projects. As Marketing & Communications Officer, she is responsible for putting CITC on the global map.
Sebastien Libon – Senior Researcher
With an MSc in materials science, a graduate certificate in Microdevices & Microsystems and 20 years working experience in electronic packaging, R&D, architecture and process engineering, Sebastien has extensive knowledge in various fields such as aerospace, power electronics, LEDs, hybrids and biomedical implants. He is a true innovator who knows how to carry innovation through to production, taking into account manufacturability, quality assurance and design possibilities. As a senior researcher, he is part of CITC’s Thermal High-Performance Packaging Program (also known as Power Packaging Program).
Henry Antony Martin – Researcher
Henry has a solid background in Mechanical Engineering from TU Eindhoven and is specialized in Mechanics of Materials (MoM). He works at CITC as a Researcher (PhD candidate) within the Thermal High-Performance Packaging program in collaboration with TU Delft. To make the next generation power electronic components smaller, faster, and more reliable, he is working on novel concepts/ processes to improve the reliability of power packages.
Dave Reijs – Micro-Electronic Packaging Engineer
Dave has a background in Mechanical Engineering. After finishing his bachelor’s at Hogeschool Den Haag, he became interested in semiconductor assembly and packaging at his first job as Final Test and Assembly Engineer for semiconductor equipment. During his further career at several companies in the semiconductor industry, he specialized in RF Power Packages for the base station/microwave and broadcast market.
Edsger Smits – Program Manager Power Packaging
Edsger is a multidisciplinary researcher and innovator with expertise in the domains of display technology, printed electronics, sensor development and heterogenous integration. He combines a strong academic background (MS in Solid State Physics and PhD with honors in Organic Electronics from the University of Groningen) with a proven track record in technology development, customer support, and project and program management. Edsger is an experienced shared research program manager who will lead the Thermal High-Performance Packaging Program.