Team Members

Gari Arutinov – Program Manager Power Packaging

Gari is an experienced researcher and innovator with over 10 years of R&D experience in the field of Printed Electronics, 3D printing, and Hybrid Assembly and Integration. He has a strong, multidisciplinary academic background (BS and MS in Applied Physics and PhD in Mechanical Engineering) and a proven track record in innovative technology development, technical customer support, and project and program management with 20+ patent applications & scientific papers. Gari is the guy that knows the ins and outs of the shared research programs that are running in our center, and as a Program Manager he is leading Thermal High-Performance Packaging Program (also known as Power Packaging Program).

Wissam Assaad – Thermo-mechanical simulation engineer

Wissam’s research interests lie in physical modelling and simulations in different domains, i.e. metal forming, material characterization, pressure wave propagation, structural dynamics, frictional heating and biomedical. He has a strong academic background: a BE in mechanical engineering, an MSc in simulation techniques in mechanical engineering and a PhD nonlinear solid mechanics – aluminium extrusion with a deformable die. He has authored 12 technical papers and holds 5 patents.

Joop Bruines – Education Consultant

Joop BruinesJoop holds a PhD in Physics and has a long engineering and managerial background in both the Electronic and the Photonic Integrated Circuits industry. He always played an active role in talent development, university relations, and technology promotion programs and now deploys his acquired experience and professional network for CITC. Joop also holds a part-time position at the HAN University of Applied Sciences as Semiconductor Packaging University Program developer.

Francesca Chiappini – Program Manager RF Chip Packaging

Francesca ChiappiniFrancesca is our Program Manager for the RF Chip Packaging Program. She has a background in physics and she has experience with open innovation in the domain of hybrid integration for printed electronics. Within the RF Chip Packaging program, Francesca works in a multidisciplinary team with expertise in packaging technology, RF  and antenna design and material science.

Sander Dorrestein – Senior Micro-Electronic Packaging Engineer

Sander Dorrestein

Sander is Micro-electronic Packaging Process Engineer at TNO and started working for CITC per May 1 2020. He will be mainly active in the Thermal High-Performance Packaging program. Sander is a mechanical engineer with special interest in micro assembly processes and technologies. He has a broad experience in the field of bonding and joining applications for both micro-electrical and micro-optical packaging. He has a proven track record of developing bonding and joining processes which are currently used in production for consumer, medical, industrial and automotive applications.

Tine Geerits – Office Manager

Tine GeeritsTine started January 2020 at CITC. She is the person that makes sure everything runs smoothly in the office. Her knowledge and experience is in supporting organizations, teaching and coaching.

Victoria Gomez-Guillamon Buendia – IC Antenna Designer

Victoria is an Antenna Scientist Innovator at TNO working on the antenna-in-package program for CITC. She has a PhD in Electrical Engineering from Heriot-Watt University (Edinburgh, United Kingdom) and a strong background in electromagnetism and antenna design. She is within the Radar Technology group and focuses on antennas for 5G/6G applications.

Peter Harmsma –  Integrated Photonics Program Manager

Peter is an expert in integrated photonics, with experience in design, manufacturing and testing in silicon photonics and indium phosphide. He received in PhD at the Delft University of Technology in 2000, and worked on the development of InP photonic receiver modules as a co-founder of ThreeFive Photonics. As a scientist at TNO his focus has been on photonic sensor systems and applications. At CITC he is the (interim) program manager of the Integrated Photonics Packaging program.

Fengze Hou – Thermal-Mechanical Simulation Engineer

Fengze received the PhD in the Electrical Sustainable Energy / Microelectronics from the Delft University of Technology. He has more than 10 years of experience in the packaging and integration, thermal management, thermo-mechanical reliability, and material characterization. So far, he has published more than 45 scientific papers and over 20 patents. In CITC, Fengze mainly focuses on the thermal-mechanical simulations.

Martien Kengen – Lab and Assembly Process Manager

Martien KengenWith an academic background in physics and his knowledge of most assembly processes, especially in wire bonding, Martien is our experienced Lab and assembly process Manager. Martien started at CITC in January 2020, setting up the assembly and lab equipment.

Christian Ketelaars – Marketing & Communications Officer

Christian is a marketing communicator with over 20 years of experience in the tech sector. She knows what it takes to successfully set up and manage marketing and communication projects. As Marketing & Communications Officer, she is responsible for putting CITC on the global map.

Henry Antony Martin – Researcher

Henry has a solid background in Mechanical Engineering from TU Eindhoven and is specialized in Mechanics of Materials (MoM). He works at CITC as a Researcher (PhD candidate) within the Thermal High-Performance Packaging program in collaboration with TU Delft. To make the next generation power electronic components smaller, faster, and more reliable, he is working on novel concepts/ processes to improve the reliability of power packages.