Semiconductor Packaging Program
Participants in the Semiconductor Packaging Program learn about the semiconductor industry and take a deep dive into the final step of chip manufacturing. The program provides a connection between education and industry and as such contributes to the training and skills of people that align with industry needs. People who are in high demand – now and in the future. The program therefore represents an important step in securing the future of the semiconductor industry in Europe.
Industry experts
The program offers its participants training in all relevant aspects of chip packaging. All lecturers are industry experts from CITC and partner organizations such as NXP, Nexperia, Delft University of Technology and TNO.
Integrated chip technology and its applications
You learn about the semiconductor industry and take a deep dive into the final step of chip manufacturing. This is the phase in which the chip is packaged in its housing. Chip packaging is becoming increasingly complex and multidisciplinary, while costs must remain low.
Developments such as integrated photonics, system-on-chip, embedded cameras, 5G antennas, sensors and micro-electro-mechanical systems place high demands on the manufacturing process… and the competencies of semiconductor staff.
Program content
The program focuses on the design and manufacturing of semiconductor packages and the associated assembly, reliability and test techniques. Topics that are covered in the theoretical lessons include:
- Semiconductors and packaging
- Advanced applications
- Basic simulation and testing
- Quality, reliability and smart manufacturing
Theory sessions
- Location: onsite at Noviotech Campus, building M, Transistorweg 5, Nijmegen (NL)
- Language: English
- Duration: 7 working days
- Start date: second half of October/November
For whom
We offer this program to professionals working or interested in the semiconductor industry, who are keen to expand or deepen their knowledge of semiconductor assembly and packaging. If you want to participate in the program but are not working in the semiconductor industry, an admission interview is required. The program requires a bachelor’s level of work and thinking.
Interested in joining the program?
Please contact us at citc@tno.nl to receive a registration form.
“I liked the approach of the program the most. It’s very pragmatic: we studied real-life problems rather than theoretical situations you see in textbooks”.
Mudit Goyal, participant edition 2021-2022
The Semiconductor Packaging Program is supported by
