CITC’s infrastructure expanded with confocal scanning acoustic microscope
June 7, 2023 – CITC’s lab has been expanded with a confocal scanning acoustic microscope (CSAM) from acoustic microscopy expert PVA TePla. The microscope provides non-destructive quality control capabilities. It will therefore allow CITC to assess the reliability of the sinter die attachment to the leadframe.
Successfully determining which materials and processes are reliable for packaging is crucial to the mass commercialization of power and WBG semiconductors. Flawless basic materials are the key to flawless products. Cracks, cavities, detachment, or inclusions result in failures in the subsequent production process, which can be avoided with the help of reliable material analysis.
To realize this in our Thermal High-Performance packaging program, CITC will use the CSAM. Three of our colleagues have been extensively trained in its use. Now, the CSAM is available for our own research projects and for third parties who’d like to check the quality of their bonding technologies.
You can take a sneak peek of the CSAM in this video in which Sebastien Libon, one of our researchers, gives a small demonstration.
Read more about the collaboration between CITC and PVA TePla