Chip Integration Technology Center

CITC is a joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. Since 1 January 2026, CITC has been part of TNO.

Evolving chip packaging technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips.

Power packaging

CITC's power packaging program concentrates on developing novel packaging concepts for power devices and innovative die attach technologies.

RF and mmWave packaging

CITC develops technologies to enable the next generation of mmWave applications.

Integrated photonics packaging

In our Integrated Photonics Packaging program, CITC supports customers with their chip packages and develop new packaging concepts.

Packaging education

CITC's Semiconductor Packaging Program offers its participants a deep dive in the final step of chip manufacturing.

Start 7th edition Semiconductor Packaging Program-1

26 October 2026

Kick-off Semiconductor Packaging course 2026

A full house today for the start of the CITC Semiconductor Packaging Program! Thirty participants have enrolled in the seventh edition of this comprehensive program.

CITC researcher holding samples of a new chip packaging concept

21 October 2026

CITC participates in CONNECT GLD consortium

CITC participates in the CONNECT GLD consortium which aims to produce the next generation of chips using less material and consuming less energy.

CITC clip package manufactured using TANAKA sintering paste

1 October 2026

CITC/TNO partners with TANAKA

TANAKA Precious Metal Technologies Co., Ltd. has partnered with CITC/TNO to advance research and development in next-generation semiconductor packaging technologies.