Bridging the gap
Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Access to Innovation
Organizing and executing innovation programs for chip packaging and integration technology.
CITC is a triplehelix collaboration. Governments, businesses and educational institutions are working together to develop a new generation of chips. An extensive ecosystem of partners supports CITC’s activities.
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Events & News
European Microwave Week 2022
From September 27-29, 2022, CITC will participate in the European Microwave Week in Milan, […]
ECOC Exhibition 2022
From September 19-21, CITC will participate in the ECOC exhibition for the first time. […]
The Vibe of the Future Festival
On September 8, CITC will be part of the inspiration festival for ambitious and […]
CITC and Henkel forge partnership to accelerate high-thermal die attach solutions
PRESS RELEASE | Nijmegen, the Netherlands and Irvine, CA | July 19, 2022 Chip […]
In memoriam Barry Peet
July 12, 2022 – We are deeply affected by the death of our colleague […]