Bridging the gap
Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Access to Innovation
Organizing and executing innovation programs for chip packaging and integration technology.
CITC is a triplehelix collaboration. Governments, businesses and educational institutions are working together to develop a new generation of chips. An extensive ecosystem of partners supports CITC’s activities.
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Read more about our application domains
Read more about how CITC is building bridges between academics and industry
Events & News
Benelux RF Conference 2023
On May 24, 2023, the seventh edition of the Benelux RF Conference will take […]
PCIM Europe 2023
From May 9 – 11, CITC will participate in PCIM Europe, the leading international […]
Fontys Engineers Meet & Match 2023
On April 18, CITC will be present at the Fontys Engineers Meet & Match […]
Another CITC student graduated
February 13, 2023 – On February 3, CITC student Marco De Martini successfully defended […]
Minor students finish Semiconductor Packaging course
January 26, 2023 – On January 25, the seven students who followed the CITC/HAN […]