Chip Integration Technology Center

CITC is a joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. Since 1 January 2026, CITC has been part of TNO.

Chip between tweezers with a leadframe as background

Evolving chip packaging technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips.

Power packaging

CITC's power packaging program concentrates on developing novel packaging concepts for power devices and innovative die attach technologies.

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RF and mmWave

CITC develops technologies to enable the next generation of mmWave applications.

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Human diving into water

Education

CITC's Semiconductor Packaging Program offers its participants a deep dive in the final step of chip manufacturing.

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Recent news

Student presenting his project results
27 August 2026

Student presents results graduation project

CITC's student Subba Vemula shared the results of his research into the performance evaluation of pressureless copper sinter paste.

CITC clip packages in operational CSAM
12 August 2026

New CITC clip packaging platform

CITC is proud to present its entirely in-house designed and developed clip packaging platform.

9 July 2026

Wrap-up first research collaboration with Vishay

We celebrated the successful closure of the first research collaboration between Vishay Intertechnology, Inc. and CITC/TNO.

POLARIS samples for reliability testing
3 July 2026

CITC tests new pressure-less QFN samples

CITC will perform reliability tests on the first QFN samples utilizing a new pressure-less sintering material as die attach.

News

Upcoming events

Electronic System-Integration Technology Conference

This year’s IEEE ESTC Conference will feature 105 oral and 108 poster presentations.

9 September 2026 until 11 September 2026

Nijmeegse Techniekdag

For the third consecutive year, CITC will participate in Techniekdag Nijmegen.

12 September 2026

IMAPS International Symposium on Microelectronics

CITC's Ruud de Wit will give two presentations at IMAPS International Symposium on Microelectronics.

28 September 2026 until 1 October 2026
Events