Bridging the gap
Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Access to Innovation
Organizing and executing innovation programs for chip packaging and integration technology.
CITC is a triplehelix collaboration. Governments, businesses and educational institutions are working together to develop a new generation of chips. An extensive ecosystem of partners supports CITC’s activities.
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Events & News
It’s Possible Session about Photonics
On December 1, CITC’s Sander Dorrestein will be of one the speakers at the […]
Photonics, Power and RF Packaging Forum 2022
On November 30, CITC and Yole Group organize a Photonics, Power and RF packaging […]
SEMICON Europa 2022
From November 15-18, CITC will be present at SEMICON Europa in Munich, Germany. Just […]
Province of Gelderland visits CITC
November 25, 2022 – On November 23, delegates of the Provincial States of Gelderland […]
Paper on the Characterization of the Dielectric Properties of Commercially Available Low-loss UV-curable Resins from 60 GHz to 90 GHz
October 26, 2022 – At the recently held European Microwave Week conference in Milan, […]