Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and performing innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops chip packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro/food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
Photonic Integration conference
On September 30, CITC and partner Jakajima will organize a conference on packaging and […]
Semiconductor Packaging University Program – edition 2021-2022
Edition 2021-2022 of the Semiconductor Packaging University Program starts first week of September. The […]
Holland Semiconductors Topic Special on Advanced Packaging
On July 1, CITC will participate in the Holland Semiconductors Topic Special on Advanced […]
First graduate Semiconductor Packaging minor
June 28, 2021 – CITC is proud to have its first student graduate the […]
Reflections on our first year: check out the CITC results infographic
June 24, 2021 – Getting close to our second birthday, CITC reflects on the […]