Integration for Tomorrow

Without advanced packaged and integrated chips, we can’t live in smart houses, drive our autonomous cars or communicate through a 5G network. CITC develops packaging and integration technology for chips to provide solutions to societal challenges.


Bridge to the Future

CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced semiconductor packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.

Access to Innovation

Organizing and running innovation programs in the field of chip packaging and integration technology.

Access to Infrastructure

Providing access to lab infrastructure as one of CITC’s key capabilities.

Access to Education

Sharing knowledge about integrated chip technology and its applications.


Evolving chip technology is not a one-man job. That’s why CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.

chip packaging technology for application domains agro or food

Societal Challenges

CITC develops semiconductor packaging and integration technology to provide solutions to societal challenges.

Application Domains
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro or food.
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Building Bridges
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
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Novio Tech Campus, Building M
Transistorweg 5T
6534 AT Nijmegen
Tel +31 85 48 35 600