Bridging the gap
Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Access to Innovation
Organizing and executing innovation programs for chip packaging and integration technology.
Access to Infrastructure
Providing access to lab infrastructure and state-of-the-art equipment.
CITC is a triplehelix collaboration. Governments, businesses and educational institutions are working together to develop a new generation of chips. An extensive ecosystem of partners supports CITC’s activities.
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Events & News
European Microwave Week 2023
From September 19-21, 2023, CITC will participate in the European Microwave Week in Berlin, […]
European Microelectronics & Packaging Conference 2023
CITC will participate in the 24th European Microelectronics & Packaging Conference (EMPC). EMPC is […]
EuroPAT Workshop 2023
On September 6 and 7, the European Packaging, Assembly, and Test (EuroPAT) – Workshop […]
Record number of students for fourth edition of Semiconductor Packaging University Program
August 30, 2023 – On Monday August 28, the fourth edition of the Semiconductor […]
CITC’s infrastructure expanded with confocal scanning acoustic microscope
June 7, 2023 – CITC’s lab has been expanded with a confocal scanning acoustic […]