Bridging the gap
Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Access to Innovation
Organizing and executing innovation programs for chip packaging and integration technology.
CITC is a triplehelix collaboration. Governments, businesses and educational institutions are working together to develop a new generation of chips. An extensive ecosystem of partners supports CITC’s activities.
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Read more about our application domains
Read more about how CITC is building bridges between academics and industry
Events & News
SEMICON Europa 2023
From November 14-17, CITC will be present at SEMICON Europa in Munich, Germany. Just […]
European Microwave Week 2023
From September 19-21, 2023, CITC will participate in the European Microwave Week in Berlin, […]
Laser World of Photonics 2023
From June 27-30, CITC will participate in the Laser World of Photonics 2023. As […]
CITC presents joint project results at ECTC
June 1, 2023 – CITC’s PhD candidate Henry Martin participated in the 73rd iEEE […]
CITC 2022 results infographic available
May 8, 2023 – CITC is pleased to present its annual results infographic. Looking […]