Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and performing innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops chip packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro/food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
SEMICON Europa 2021
From November 16-19, CITC will be present at SEMICON Europa. We are pleased to […]
Photonic Integration conference
On September 30, CITC and partner Jakajima will organize a conference on packaging and […]
SEMI Packaging Technology Seminar
On September 28 and 29, CITC will be present at the SEMI Packaging Technology […]
Second edition Semiconductor Packaging University Program kicked off
On August 30, the second edition of the Semiconductor Packaging University Program kicked off […]