Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced semiconductor packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops semiconductor packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro or food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
Semiconductor Packaging University Program – Edition 2021-2022
Edition 2021-2022 of the Semiconductor Packaging University Program starts first week of September. The […]
Holland Semiconductors Topic Special on Advanced Packaging
On July 1, CITC will participate in the Holland Semiconductors Topic Special on Advanced […]
Semiconductors in a geopolitical perspective
April 29: Holland Semiconductors Topic Special (online) – Semiconductors in a geopolitical perspective These […]
Let’s explain how CITC enables 5G
June 14, 2021 – CITC is proud to be part of the 7th Innovate […]
Mintres and diamond: CITC’s ‘best’ friend in Thermal-Management
May 3, 2021 – Efficient Thermal-Management is an ongoing challenge in electronics and opto-electronics […]