Bridging the gap
Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Access to Innovation
Organizing and executing innovation programs for chip packaging and integration technology.
CITC is a triplehelix collaboration. Governments, businesses and educational institutions are working together to develop a new generation of chips. An extensive ecosystem of partners supports CITC’s activities.
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Events & News
Photonics West 2024
From January 30 until February 1, 2024, CITC will exhibit at Photonics West 2024. […]
SEMICON Japan 2023
From December 13-15, CITC will make its debut at SEMICON Japan. Together with our […]
SEMICON Europa 2023
From November 14-17, CITC will be present at SEMICON Europa in Munich, Germany. Just […]
Interns at CITC develop chip packaging demo model
November 9, 2023 – Two more students have completed their internship at CITC: Matteo […]
Spotlight on reliability lab activities at CITC
October 30, 2023 – Reliability. According to our Ph.D. researcher Henry Antony Martin, this […]