Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced semiconductor packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops semiconductor packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro or food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
PHOTONICS+ Virtual Exhibition and Conference
On February 17+18 CITC is exhibiting at the PHOTONICS+ Virtual Exhibition and Conference – […]
Power and RF Virtual Forums replay available
On November 24th and December 1st 2020 the Virtual Forum for Power and RF […]
SEMICON JAPAN | 11-12-2020
From December 11-18 SEMICON Japan online conferences takes place: the event that shows the […]
Internship and graduation assignments
January 4 2021 – A new year with new opportunities! There are possibilities for […]
Photonics Assembly Consortium: PODIUM
PRESS RELEASE | December 15 2020 – Today Chip Integration Technology Center (CITC), Tegema, […]