Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced semiconductor packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops semiconductor packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro or food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
Invitation: Virtual Forums
Power and RF Packaging Virtual Forums – presented by Yole Développement and CITC – […]
Splashing CITC Opening: March 5 2020
CITC was officially opened on March 5 2020. The opening event was very balanced, […]
High-Tech Network Meeting: Sept. 16 2019
On Thursday, September 16 at 4 pm, the Meet & Greet on Novio Tech […]
CITC and HAN course taps into increasing chip packaging complexity
BITS&CHIPS| Paul van Gerven | July 17 2020 As IC packaging becomes increasingly complex […]
Semiconductor Packaging University Program
July 9 2020 – Together with the HAN University of Applied Sciences, CITC developed […]