Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced chip packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and performing innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops chip packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro/food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
SEMICON Europa 2022
From November 15-18, CITC will be present at SEMICON Europa in Munich, Germany. Just […]
European Microwave Week 2022
From September 27-29, 2022, CITC will participate in the European Microwave Week in Milan, […]
ECOC Exhibition 2022
From September 19-21, CITC will participate in the ECOC exhibition for the first time. […]
CITC presents at EuroSimE 2022
April 21, 2022 – On April 25, CITC’s Henry Martin will present his work […]
PhotonDelta lands €1.1 billion to usher in a new generation of semiconductor technology
PRESS RELEASE | Eindhoven, April 14, 2022 – PhotonDelta, a cross-border ecosystem of photonic chip […]