Bridging the gap
Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. Together, we work on a new generation of packages providing smart, safe and rugged housing for chips. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
Access to Innovation
Organizing and executing innovation programs for chip packaging and integration technology.
CITC is a triplehelix collaboration. Governments, businesses and educational institutions are working together to develop a new generation of chips. An extensive ecosystem of partners supports CITC’s activities.
Future societal challenges in energy, healthcare, mobility, agriculture and food mean that an increasing degree of intelligence must be built into products and services. As a key enabling technology, chips and their packages make this intelligence possible.
CITC brings leading innovations in chip integration and packaging to market in a selected and growing number of application areas. As such, we provide solutions to societal challenges: integration for tomorrow.
Events & News
SEMICON Europa 2022
From November 15-18, CITC will be present at SEMICON Europa in Munich, Germany. Just […]
PIC Summit Europe 2022
On November 7 and 8, CITC will participate in PIC Summit Europe. This is […]
ECOC Exhibition 2022
From September 19-21, CITC will participate in the ECOC exhibition for the first time. […]
Kick-off third edition Semiconductor Packaging University Program
August 29, 2022 – Today, the third edition of the Semiconductor Packaging University Program […]
New addition to CITC lab: Scanning Electron Microscope
August 22, 2022 – Last week, CITC welcomed a new addition to its lab: […]