Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced semiconductor packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops semiconductor packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro or food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
Semiconductor Packaging University Program – Edition 2021-2022
Edition 2021-2022 of the Semiconductor Packaging University Program starts first week of September. The […]
Semiconductors in a geopolitical perspective
April 29th: Holland Semiconductors Topic Special (online) – Semiconductors in a geopolitical perspective These […]
Fontys Engineers Meet & Match 2021
On April 8th CITC participated in the annual Fontys Meet & Match event. It […]
Educating the next generation of high tech talent
April 1 2021 | Novio Tech Campus – Together with HAN University of Applied […]
CITC Accredited Work Placement Company, first MBO trainees started
March 11 2021 – CITC received its qualification as an Accredited Work Placement Company […]