Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced semiconductor packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.
Evolving chip technology is not a one-man job. That’s why CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
CITC develops semiconductor packaging and integration technology to provide solutions to societal challenges.
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro or food.
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
Events & News
Invitation: Virtual Forums
Power and RF Packaging Virtual Forums – presented by Yole Développement and CITC – […]
Benelux RF Conference 2020
The fifth edition of the Bits&Chips Benelux RF Conference takes place November 12th (ONLINE). […]
High Tech NL ‘Te gast bij CITC’
On Wednesday October 14th High Tech NL organized ‘High Tech NL Te gast bij […]
Chip package mock-up & lab video
October 19 2020 – It is a pleasure to share a new CITC video […]
Packing computer chips at CITC Nijmegen
October 2 2020 – RN7 and Omroep Gelderland published a nice news item about […]