Bridge to the Future
CITC is a non-profit innovation center that specializes in heterogeneous integration and advanced packaging technology. It is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. Therefore we offer access to innovation, infrastructure and education.
Access to Innovation
Organizing and running innovation programs in the field of chip packaging and integration technology.
Partners
Evolving chip technology is not a one-man job. That’s why CITC is a Triplehelix collaboration. Governments, businesses and knowledge institutes are working together in developing a new generation of chips. The activities of CITC are supported by a vast ecosystem.
Societal Challenges
CITC develops packaging and integration technology for chips to provide solutions to societal challenges.
Application Domains
We work on technology that helps to provide answers to societal challenges for the following application domains: energy, mobility, communication, care and agro or food.
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Building Bridges
We enable and stimulate economic opportunities and strengthen the existing ecosystem of companies and knowledge institutes. This is done by sharing knowledge, developing talent and start-up support.
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