Publications
Our researchers and PhD candidates regularly publish their findings in scientific magazines. Below you will find an overview of CITC's scientific publications over the years.
2026
Organics-free Porous Nano-dendritic Cu Films for High-Power Packaging Interconnects
IEEE Electronic Components and Technology Conference (ECTC)
Additive Fan-Out Packaging for Discrete Components
IEEE Electronic Components and Technology Conference (ECTC)
Co-packaged electronics with microfluidics for direct-to-package cooling
Communications Engineering – open access journal from Nature portfolio
2025
Additive Fan-Out Packaging for Discrete Components
IEEE CPMT Symposium Japan (ICSJ)
Multi-objective 3D topology optimisation for heat sinks with multiple heat sources
24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Fabrication and Characterization of 3D printed mmWave RF devices
19th European Conference on Antennas and Propagation (EuCAP)
On the pronounced mode dependency of the interface fracture toughness of pressureless sintered silver interconnects: Identification of dissipative micro-mechanisms
Engineering Fracture Mechanics
2024
Prognostic Monitoring of Power QFN Packages With Silver Sintered Die-Attach Materials
IEEE Transactions on Components, Packaging and Manufacturing Technology
Advancing the semiconductorisation of photonic chip packaging
PIC Magazine, issue 4, p. 32-39
Additive Fan-Out Panel-Level Processing of MOSFET Devices
IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024, p. 1-6
Thermal characterization methodology for thin bond-line interfaces with high conductive materials
Thermal Science and Engineering Progress
A 2-Tier TRL Calibration Technique to Assess Flip-Chip Interconnects at D-Band
103rd ARFTG Microwave Measurement Conference (ARFTG), Washington, DC, USA, 2024
An Analytical Model Describing Residual Stresses in Thin Die Attach Layer
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
An Outlook on Power Electronics Reliability and Reliability Monitoring
Recent Advances in Microelectronics Reliability (chapter in book, p. 251-282)
Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
IEEE Transactions on Power Electronics
2023
Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames
24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
IEEE 73rd Electronic Components and Technology Conference (ECTC)
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2022
Characterization of the Dielectric Properties of Commercially Available Low-loss UV-curable Resins from 60 GHz to 90 GHz
52nd European Microwave Conference (EuMC)
In-situ reliability monitoring of power packages using a Thermal Test Chip
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)