Power packaging

Due to the ongoing miniaturization of electronic components, there is a persistent trend towards higher power density in semiconductor devices. Wide band gap (WBG) materials, such as gallium nitride (GaN) and silicon carbide (SiC), enable more efficient power components that can operate at higher operating temperatures. Therefore, our research focuses on improving heat dissipation and reducing mechanical stresses.

Wirebonded power package

The main challenges in power die and clip attach relate to reliability, performance, and environmental aspects.

Thermo-mechanical design strategies

To address these challenges, our high-performance power packaging program concentrates on developing novel thermo-mechanical design and device platforms using silver sintering on copper lead frames. These platforms are composed of low-stress and high-reliability rugged interconnect and encapsulation solutions with high power dissipation capability.

Improve reliability

Successfully determining which die/clip bonding materials and processes are reliable for packaging is crucial to mass commercialization of power and WBG semiconductors. It will also help improve the reliability of existing and future WBG-based packaging. Die/clip attach and encapsulation appear to be performance and reliability-limiting factors, which do not yet allow semiconductor power devices to operate at their full potential.

Key competences

Our approach for finding rugged die/clip attach solutions is powered by our key competences:

  • Standardized assembly and integration
  • Thermomechanical modeling and simulations
  • In-package reliability and functional testing
  • In-situ failure detection, monitoring and prediction

Power packaging (r)evolution

From wire/clip bond packaging to additive fan-out packaging.


Leadframe with power dies attached

Wire/clip bond packaging

  • Traditional packaging technology
  • Proven process and reliability performance
  • Using installed equipment base
  • Limited in integration, miniaturization
Additive fan-out package between tweezers

Additive fan-out packaging

  • Using 100% additive and more sustainable panel fan-out process
  • Disruptive performance increase
  • Significantly lower packaging cost due to simplified back-end process
Overmolded chip sample with micro-fluidic cooling

Advanced thermal management integration

Within the high-performance power packaging program, CITC is also working on the following topics:

  • Heterogeneous integration of diamond heat spreaders for effective heat dissipation and reduction of junction temperatures
  • Topology-optimized near-chip micro-fluidic cooling developed for highest heat dissipation (see picture on the right)