Upcoming events
3 November 2026
Milan, Italy
The theme of this year's workshop is 'High Reliability Packaging for Avionics, Aerospace & Defense'.
CITC's Edsger Smits will give a presentation.
11 November 2026
Munich, Germany
This year’s Advanced Packaging Conference aims to explore the latest trends, challenges, and breakthroughs shaping the future of advanced packaging. CITC's Sander Dorrestein and Henry Antony Martin will give presentations at the conference.
26 November 2026
Tours, France
IMAPS-France proudly announces the 16th edition of the Power Electronics and Packaging Technical Workshop. Several packaging themes will be addressed:
- New materials and substrates dedicated to power electronics
- Thermal or thermo mechanical or regulatory constraints
- Dedicated technologies for integration and optimization of power systems
- Innovative technologies, materials and processes dedicated to interconnection and packaging
- Reliability and failure modes
- High current and high voltage or extremely high voltage: impact on packaging technologies
CITC's Henry Antony Martin will give a presentation about co-designed and co-packaged thermal solutions for advanced semiconductor packaging. Ruud de Wit will attend the workshop as well.