Upcoming events
This year’s IEEE ESTC Conference will feature 105 oral and 108 poster presentations highlighting new developments in advanced packaging, wafer-level packaging, reliability of electronic devices and power electronics. CITC/TNO will have a booth in the conference area.
For the third consecutive year, CITC will participate in Techniekdag Nijmegen. This event is intended for children aged 8 to 14 to introduce them to technology in an interactive way. Team CITC will share a booth with Sempro Technologies.
The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society. It offers one of the most robust programs for microelectronics and advanced packaging technical content. CITC's Ruud de Wit will give two presentations at the conference.
Every fall all members of the Graduate School gather at the annual Engineering Mechanics symposium. This two-day symposium revolves around four themes that are selected based on contemporary trends and challenges in the field. CITC's Noud Schoenmakers will give a presentation about failure mechanics.
This year’s Advanced Packaging Conference aims to explore the latest trends, challenges, and breakthroughs shaping the future of advanced packaging. CITC's Sander Dorrestein and Henry Antony Martin will give presentations at the conference.
IMAPS-France proudly announces the 16th edition of the Power Electronics and Packaging Technical Workshop. Several packaging themes will be addressed:
- New materials and substrates dedicated to power electronics
- Thermal or thermo mechanical or regulatory constraints
- Dedicated technologies for integration and optimization of power systems
- Innovative technologies, materials and processes dedicated to interconnection and packaging
- Reliability and failure modes
- High current and high voltage or extremely high voltage: impact on packaging technologies
CITC's Ruud de Wit and Edsger Smits will attend the workshop.