IMAPS-France proudly announces the 16th edition of the Power Electronics and Packaging Technical Workshop. Several packaging themes will be addressed:
- New materials and substrates dedicated to power electronics
- Thermal or thermo mechanical or regulatory constraints
- Dedicated technologies for integration and optimization of power systems
- Innovative technologies, materials and processes dedicated to interconnection and packaging
- Reliability and failure modes
- High current and high voltage or extremely high voltage: impact on packaging technologies
CITC's Ruud de Wit and Edsger Smits will attend the workshop.
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