RF and mmWave packaging

CITC’s RF and mmWave packaging program is developing technologies to enable the next generation mmWave applications such as 6G and automotive radar. Our focus is on miniaturization using through polymer via (TPV) technology and antenna-in-package (AiP) architectures.

Packaging technology is more important than ever and is a key enabler for high-frequency performance and highly integrated next-generation RF systems. CITC is working on various advanced packaging solutions based on thin-film electronics and semi-additive manufacturing.

Integration within one package

AiP architectures are adopted for many devices in order to reduce losses, improve performance and reduce costs. Within an AiP system, different elements such as antennas, integrated circuits (ICs), passive components and RF elements are integrated within one package. This high level of integration poses several technological challenges and calls for new solutions for, among others, low-losses interconnect, electro-magnetic interference (EMI) shielding and antenna integration.


Low-loss redistribution layer sample

Low-loss redistribution layer (RDL)

In order to realize a low-loss interconnect and routing with high-frequency insulation and high reliability, we demonstrated a 2-layer dielectric 3-layer Cu metallization package. The development towards more layers is ongoing.

Fan-out panel level packaging Gen1 plate

Fan-out panel level packaging (FO-PLP)

We are working on several 3D panel level fan-out technologies based on our first generation platform (352x320 mm):

  • 3D fan-out package - based on die first (RDL last) fan-out technology
  • Molded interposer - based on RDL first (die last) fan-out technology
Through polymer interconnects for antenna-in-package

Through polymer interconnects for antenna-in-package

Shielded interconnects and continuous walls are of great importance to ensure high-frequency insulation within highly integrated compact RF packages.

Based on our high aspect ration polymer-core via technology, our aim is to take this technology to a higher maturity level.