Ruud de Wit

Functie:

Business Development Manager

Ruud has a background in Mechanical Engineering and approximately 25 years of semiconductor back-end assembly experience in global key account management, global product management, and new business development, in die attach, sintering and wafer level encapsulation.

E-mail:
E-mail Ruud
LinkedIn:
Ruud on LinkedIn

Ruud supports CITC’s expanding power and RF semiconductor testing capabilities and new advanced chip packaging developments. In addition to his work at CITC, he is also a member of the technical committee at SEMI for the Advanced Packaging Conference.

Publications

Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames
24th European Microelectronics and Packaging Conference & Exhibition (EMPC)