Dave Reijs

Dave studied Mechanical Engineering and has worked as a Package and Assembly Engineer in the semiconductor industry for 25 years. During his years at Besi, Philips, NXP, Elmos and Ampleon, he worked primarily at RF Power, where he focused on die-attach, wire bonding and new package development. He worked closely with production sites and therefore understands the process of maturing innovative ideas and preparing them for production.