Edsger Smits
Edsger combines a strong academic background - MSc in Solid State Physics and PhD with honors in Organic Electronics - with a proven track record in technology development, customer support, and project and program management.
Edsger is a multidisciplinary researcher and innovator with expertise in the domains of display technology, printed electronics, sensor development and heterogenous integration. He is an experienced shared research program manager who leads the Power Packaging program.
Publications
Additive Fan-Out Packaging for Discrete Components
IEEE Electronic Components and Technology Conference (ECTC)
Co-packaged electronics with microfluidics for direct-to-package cooling
Communications Engineering – open access journal from Nature portfolio
Additive Fan-Out Packaging for Discrete Components
IEEE CPMT Symposium Japan (ICSJ)
On the pronounced mode dependency of the interface fracture toughness of pressureless sintered silver interconnects: Identification of dissipative micro-mechanisms
Engineering Fracture Mechanics
Prognostic Monitoring of Power QFN Packages With Silver Sintered Die-Attach Materials
IEEE Transactions on Components, Packaging and Manufacturing Technology
Additive Fan-Out Panel-Level Processing of MOSFET Devices
IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024, pp. 1-6
Thermal characterization methodology for thin bond-line interfaces with high conductive materials
Thermal Science and Engineering Progress
An Analytical Model Describing Residual Stresses in Thin Die Attach Layer
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
An Outlook on Power Electronics Reliability and Reliability Monitoring
Recent Advances in Microelectronics Reliability (chapter in book, p. 251-282)
Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
IEEE Transactions on Power Electronics
Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames
24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
In-situ reliability monitoring of power packages using a Thermal Test Chip
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)