Francesca Chiappini
Francesca holds a PhD in Physics and has extensive experience with open innovation in the domain of hybrid integration for printed electronics. She has been program manager for RF and mmWave packaging since CITC was founded. As of 1 July 2025, the daily management of CITC is in her hands.
Publications
Additive Fan-Out Packaging for Discrete Components
IEEE Electronic Components and Technology Conference (ECTC)
Additive Fan-Out Packaging for Discrete Components
IEEE CPMT Symposium Japan (ICSJ)
Fabrication and Characterization of 3D printed mmWave RF devices
19th European Conference on Antennas and Propagation (EuCAP)
Additive Fan-Out Panel-Level Processing of MOSFET Devices
IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024, pp. 1-6
A 2-Tier TRL Calibration Technique to Assess Flip-Chip Interconnects at D-Band
103rd ARFTG Microwave Measurement Conference (ARFTG), Washington, DC, USA, 2024
Characterization of the Dielectric Properties of Commercially Available Low-loss UV-curable Resins from 60 GHz to 90 GHz
52nd European Microwave Conference (EuMC)