Frans Meeuwsen

Functie:

Packaging Engineer

Frans has a long track record in semiconductor packaging with previous employers such as Philips, NXP and Ampleon. He started in 1985 as an assembly engineer, primarily for RF packages. He now works at CITC as packaging engineer, focusing on tool engineering and package architecture.

E-mail:
E-mail Frans
LinkedIn:
Frans on LinkedIn

Publications

Additive Fan-Out Packaging for Discrete Components
IEEE CPMT Symposium Japan (ICSJ)