Henry Antony Martin
Henry holds a PhD in Mechanical Engineering and specializes in Mechanics of Materials. At CITC, he works on the Power Packaging program. To make the next generation power electronic components smaller, faster, and more reliable, he is working on new concepts and processes to improve the reliability of power packages.
Publications
Co-packaged electronics with microfluidics for direct-to-package cooling
Communications Engineering – open access journal from Nature portfolio
Multi-objective 3D topology optimisation for heat sinks with multiple heat sources
24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Prognostic Monitoring of Power QFN Packages With Silver Sintered Die-Attach Materials
IEEE Transactions on Components, Packaging and Manufacturing Technology
Thermal characterization methodology for thin bond-line interfaces with high conductive materials
Thermal Science and Engineering Progress
Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
An Outlook on Power Electronics Reliability and Reliability Monitoring
Recent Advances in Microelectronics Reliability (chapter in book, p. 251-282)
Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
IEEE Transactions on Power Electronics
Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames
24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
IEEE 73rd Electronic Components and Technology Conference (ECTC)
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
In-situ reliability monitoring of power packages using a Thermal Test Chip
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)