Noud Schoenmakers

Functie:

Researcher

Noud has a background in Mechanical Engineering, specializing in Mechanics of Materials. He is a PhD candidate and works at CITC as a researcher within the Power Packaging program. As the chip industry requires an adhesive with a higher melting temperature than is currently possible, he is continuing his previous research into fracture and fatigue of silver sinter joints designed for power electronics.

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E-mail Noud
LinkedIn:
Noud on LinkedIn

Publications

On the pronounced mode dependency of the interface fracture toughness of pressureless sintered silver interconnects: Identification of dissipative micro-mechanisms
Engineering Fracture Mechanics