Ruben Pranger
Ruben has a background in Electrical Engineering and previous work experience in chip front-end operations in the Dry-etch segment. After successfully completing his graduation project at CITC, he is now part of the CITC lab team and coordinator of the Semiconductor Packaging Program.
Publications
Organics-free Porous Nano-dendritic Cu Films for High-Power Packaging Interconnects
IEEE Electronic Components and Technology Conference (ECTC)
Additive Fan-Out Packaging for Discrete Components
IEEE Electronic Components and Technology Conference (ECTC)
Additive Fan-Out Packaging for Discrete Components
IEEE CPMT Symposium Japan (ICSJ)
An Analytical Model Describing Residual Stresses in Thin Die Attach Layer
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)